SCHEMBL29640371

SCHEMBL29640371

Oc1ccc(Oc2ccc(O)c(O)c2O)c(O)c1O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HIF1A Q16665 1/20 0.41
EPAS1 Q99814 1/20 0.41
LMNA P02545 4/20 0.39
HPGD P15428 4/20 0.39
MAPT P10636 3/20 0.39
ALOX15 P16050 3/20 0.39
ALDH1A1 P00352 2/20 0.39
HSD17B10 Q99714 2/20 0.39
KDM4E B2RXH2 1/20 0.39
TP53 P04637 1/20 0.39
CYP3A4 P08684 1/20 0.39
ALOX12 P18054 1/20 0.39
MAPK1 P28482 1/20 0.39
SELL P14151 1/20 0.39
SELP P16109 1/20 0.39
PIM1 P11309 1/20 0.38
ADAMTS4 O75173 1/20 0.38
EGFR P00533 1/20 0.38
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8582074 0.81 TTR (0.52) HPGDALDH1A1HSD17B10KDM4ECYP3A4
SCHEMBL9742294 0.78 KDM4E (0.65) HIF1AEPAS1LMNAHPGDMAPT
SCHEMBL29373601 0.77 ALDH1A1 (0.57) HIF1ALMNAHPGDMAPTALOX15
SCHEMBL338346 0.77 ALDH1A1 (0.57) HIF1ALMNAHPGDMAPTALOX15
SCHEMBL88340 0.77 LMNA (0.64) HIF1ALMNAHPGDMAPTALOX15
SCHEMBL21647668 0.76 HIF1A (0.42) HIF1AEPAS1LMNAHPGDMAPT
Hydrochloric Acid SCHEMBL21799214 0.73 ALDH1A1 (0.53) HIF1ALMNAHPGDMAPTALOX15
Hydrochloric Acid SCHEMBL28771575 0.73 ALDH1A1 (0.53) HIF1ALMNAHPGDMAPTALOX15
SCHEMBL2160829 0.72 SELL (0.37) HIF1AEPAS1LMNAHPGDMAPT
SCHEMBL8019452 0.72 INPPL1 (0.37) HIF1AEPAS1LMNAHPGDMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114514470-A Pattern forming method, photosensitive resin composition, method for manufacturing laminate, and method for manufacturing semiconductor device 富士胶片株式会社 2022-05-17 CN disclosed