Known targets — ChEMBL curated mechanism
ABL1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB2AGTR1BCL2BCL2A1BCL2L1BCL2L10BCL2L2BCRBRAFCHRM1CHRNA10CHRNA9DRD1DRD2DRD3DRD4DRD5EGFRF2FLT1FLT4GCKGHSRGNRHRGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHTR1AHTR1BHTR1DHTR2AHTR2CHTR3AIDH2KDRKITMAOBMCL1MTTPPP4HBPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PIKFYVEROCK1ROCK2SLC18A2SLC6A2SLC6A3SLC6A4TACR1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8gyrAgyrBparCparEpol
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27873975 | 1.00 | — | — | |
| SCHEMBL4074218 | 1.00 | CA2 (0.54) | — | |
| SCHEMBL28175121 | 0.95 | — | — | |
| SCHEMBL20952510 | 0.95 | — | — | |
| SCHEMBL28196050 | 0.95 | — | — | |
| Water SCHEMBL28765208 | 0.95 | — | — | |
| SCHEMBL29662182 | 0.95 | — | — | |
| Hydrogen Peroxide SCHEMBL28116494 | 0.95 | — | — | |
| Sulfuric Acid SCHEMBL28003070 | 0.95 | CA5A (0.60) | — | |
| SCHEMBL246838 | 0.94 | CA2 (0.58) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2272 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122013191-A | Environment-friendly recycling method for extracting copper, tin and lead from retired photovoltaic solder strip | 中国电器科学研究院股份有限公司 | 2026-05-12 | — | — | CN | claimed |
| US-20250215598-A1 | LEVELING AGENT, COMPOSITION, AND APPLICATION THEREOF | HUAWEI TECHNOLOGIES CO., LTD. (CN) | 2025-07-03 | — | — | US | claimed |
| US-20250198036-A1 | COMPOSITION AND APPLICATION THEREOF, AND LEVELING AGENT AND PREPARATION METHOD THEREOF | HUAWEI TECH CO LTD (CN) | 2025-06-19 | — | — | US | claimed |
| CN-222984113-U | Copper methylsulfonate production is with high-efficient tail gas absorption tower | 湖北金鸡化工股份有限公司 | 2025-06-17 | — | — | CN | claimed |
| EP-4563621-A1 | LEVELING AGENT, COMPOSITION, AND USE THEREOF | Huawei Technologies Co., Ltd. (CN) | 2025-06-04 | — | — | EP | claimed |
| EP-4560053-A1 | COMPOSITION AND USE THEREOF, LEVELING AGENT, AND PREPARATION METHOD | Huawei Technologies Co., Ltd. (CN) | 2025-05-28 | — | — | EP | claimed |
| CN-119980375-A | Electroplating solution for filling holes of HDI board and preparation method | 惠州市荣安达化工有限公司 | 2025-05-13 | — | — | CN | claimed |
| CN-119857534-A | Preparation method of foam copper-based catalytic material for electrochemical degradation of chloramphenicol sewage | 北方工业大学 | 2025-04-22 | — | — | CN | claimed |
| CN-119772447-A | Preparation method and application of polymer copper powder mixed core solder ball | 上海锡喜材料科技有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-119433643-A | Copper electroplating method for filling through holes of IC carrier plate | 芯聚德科技(安徽)有限责任公司 | 2025-02-14 | — | — | CN | claimed |
| EP-1338031-A2 | COPPER ALLOY INTERCONNECTIONS FOR INTEGRATED CIRCUITS AND METHODS OF MAKING SAME | INTEL CORPORATION (US) | 2003-08-27 | — | — | EP | claimed |
| US-20030131753-A1 | Electroplating solution for high speed plating of tin-copper solder | TECHNOLOGIES INC. | 2003-07-17 | — | — | US | claimed |
| WO-2002045142-A9 | COPPER ALLOY INTERCONNECTIONS FOR INTEGRATED CIRCUITS AND METHODS OF MAKING SAME | INTEL CORP (US) | 2003-02-06 | — | — | WO | claimed |
| CN-1100893-C | Layered material for sliding elements, method for the production thereof and agent therefor | GLYCO METALL WERKE (DE) | 2003-02-05 | — | — | CN | claimed |
| CN-1384105-A | Asymmetric copper compound and cyclopropanation reaction with it | SUMITOMO CHEMICAL CO (JP) | 2002-12-11 | — | — | CN | claimed |
| US-20020177718-A1 | Asymmetric copper complex and cyclopropanation reaction using the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-11-28 | — | — | US | claimed |
| EP-1253135-A1 | Asymmetric copper complex and cyclopropanation reaction using the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-10-30 | — | — | EP | claimed |
| WO-2002045142-A2 | COPPER ALLOY INTERCONNECTIONS FOR INTEGRATED CIRCUITS AND METHODS OF MAKING SAME | INTEL CORPORATION (US) | 2002-06-06 | — | — | WO | claimed |
| CN-1169166-A | Layered material for sliding elements, method for the production thereof and agent therefor | GLYCO METALL WERKE (DE) | 1997-12-31 | — | — | CN | claimed |
| US-4451577-A | STRONG ACID SALT AND POLYVINYLALCOHOL | THE QUAKER OATS COMPANY (US) | 1984-05-29 | — | — | US | claimed |