SCHEMBL297765

SCHEMBL297765

CCCS(=O)(=O)O/N=C(/C#N)c1ccc(C)cc1

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.33
GAA P10253 3/20 0.33
ALDH1A1 P00352 2/20 0.33
MAPT P10636 2/20 0.32
THRB P10828 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
MEN1 O00255 1/20 0.32
NPC1 O15118 1/20 0.32
LMNA P02545 1/20 0.32
RAB9A P51151 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
MRGPRX1 Q96LB2 1/20 0.32
GLA P06280 1/20 0.31
ENPP1 P22413 1/20 0.31
PKM P14618 1/20 0.30
HPGD P15428 1/20 0.30
SLC6A3 Q01959 2/20 0.30
TDP1 Q9NUW8 1/20 0.30
PAX8 Q06710 1/20 0.30
SLC6A2 P23975 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL36729 1.00 KMT2A (0.33) KMT2AGAAALDH1A1MAPTTHRB
SCHEMBL14707492 0.90 L3MBTL1 (0.38) ALDH1A1MAPTTHRBL3MBTL1NPC1
SCHEMBL2702572 0.87 PLA2G7 (0.40) KMT2AALDH1A1MAPTL3MBTL1MEN1
SCHEMBL2702574 0.87 PLA2G7 (0.40) KMT2AALDH1A1MAPTL3MBTL1MEN1
SCHEMBL4825409 0.86 RECQL (0.39) KMT2AGAAALDH1A1MAPTMEN1
SCHEMBL4825418 0.86 RECQL (0.39) KMT2AGAAALDH1A1MAPTMEN1
SCHEMBL13197850 0.86 KDM4E (0.31)
SCHEMBL17557252 0.86 LMNA (0.33) ALDH1A1MAPTNPC1LMNARAB9A
SCHEMBL18431384 0.86 LMNA (0.33) ALDH1A1MAPTNPC1LMNARAB9A
SCHEMBL9891194 0.86 LMNA (0.33) ALDH1A1MAPTNPC1LMNARAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 300 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250321485-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-16 US disclosed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
EP-3896522-B1 PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2023-05-03 EP disclosed
US-20230096312-A1 RESIST COMPOSITION AND METHOD FOR USING RESIST COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-03-30 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-11256170-B2 Compound, resist composition, and method for forming resist pattern using it MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-22 US disclosed
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-08 US disclosed
EP-3896522-A1 PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2021-10-20 EP disclosed
CN-108137478-B Compound, composition thereof, purification method, resist pattern formation method, and amorphous film production method 三菱瓦斯化学株式会社 2021-09-28 CN disclosed
CN-107924123-B Material for lithography, method for producing same, composition for lithography, method for forming pattern, compound, resin, and method for purifying same 学校法人关西大学 2021-08-06 CN disclosed
US-6723485-B1 HEXAFLUOROISOPROPYL (METH)ACRYLATE RESIN AND PHOTOACID GENERATOR; LASER HAVING WAVELENGTH IN VACUUM ULTRAVIOLET REGION CENTRAL GLASS COMPANY, LIMITED (JP) 2004-04-20 US disclosed
EP-1400853-A1 POSITIVE RESIST COMPOSITION OF CHEMICAL AMPLIFICATION TYPE, RESIST COATED MATERIAL, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE TOKYO OHKA KOGYO CO., LTD. (JP) 2004-03-24 EP disclosed
US-20030190550-A1 Positive resist composition of chemical amplification type, resist coated material, method of forming resist pattern, and process for producing semiconductor device TOKYO OHKA KOGYO CO., LTD. (JP) 2003-10-09 US disclosed
EP-0780729-B1 Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO LTD (JP) 2002-07-10 EP disclosed
EP-1103856-A1 Positive resist composition & process for forming resist pattern using same Central Glass Company, Limited (JP) 2001-05-30 EP disclosed
US-6153354-A INCLUDING ALKALI-SOLUBLE RESIN, ACID-CROSSLINKABLE SUBSTANCE, ACID GENERATING AGENT, AND SENSITIZING SUBSTANCE TOKYO OHKA KOGYO CO., LTD. (JP) 2000-11-28 US disclosed
US-6063953-A Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2000-05-16 US disclosed
US-6022666-A Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2000-02-08 US disclosed
US-5902713-A Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1999-05-11 US disclosed
EP-0780729-A1 Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1997-06-25 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 KMT2A 2526/4885GAA 2880/4885ALDH1A1 3830/4885
US-11256170-B2 Compound, resist composition, and method for forming resist pattern using it RDX, SLC11A2, FBL KMT2A 1321/4885GAA 3007/4885ALDH1A1 2889/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R KMT2A 633/4885GAA 4768/4885ALDH1A1 1540/4885
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R KMT2A 633/4885GAA 4768/4885ALDH1A1 1540/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.