Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.35 |
| ▸ | MEN1 | O00255 | 2/20 | 0.35 |
| ▸ | POLB | P06746 | 3/20 | 0.33 |
| ▸ | HTT | P42858 | 2/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | NPC1 | O15118 | 2/20 | 0.31 |
| ▸ | RAD52 | P43351 | 2/20 | 0.31 |
| ▸ | RAB9A | P51151 | 2/20 | 0.31 |
| ▸ | MITF | O75030 | 1/20 | 0.31 |
| ▸ | DNMT1 | P26358 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | UHRF1 | Q96T88 | 1/20 | 0.31 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | SMARCA2 | P51531 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8016458 | 0.84 | HTT (0.37) | ALDH1A1KMT2AMEN1HTTLMNA | |
| SCHEMBL13232295 | 0.84 | ALDH1A1 (0.34) | ALDH1A1KMT2AMEN1POLBHTT | |
| SCHEMBL912644 | 0.81 | UBE2M (0.36) | ALDH1A1KMT2ALMNA | |
| Hydrochloric Acid SCHEMBL9662206 | 0.79 | DCUN1D1 (0.39) | ALDH1A1KMT2ALMNA | |
| Ammonia Solution, Strong SCHEMBL10363130 | 0.79 | UBE2M (0.36) | ALDH1A1KMT2ALMNA | |
| SCHEMBL7430903 | 0.79 | UBE2M (0.36) | ALDH1A1KMT2ALMNA | |
| SCHEMBL2561990 | 0.78 | — | — | |
| SCHEMBL7602935 | 0.77 | — | — | |
| SCHEMBL17153824 | 0.77 | POLB (0.34) | ALDH1A1KMT2AMEN1POLBHTT | |
| SCHEMBL17153740 | 0.76 | KMT2A (0.48) | ALDH1A1KMT2AMEN1POLBHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 183 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120138738-A | Electronic plating cobalt additive composition for hole filling and application thereof | 厦门大学 | 2025-06-13 | — | — | CN | claimed |
| US-12071703-B2 | Electroplating solution for indium-bismuth alloy for low-temperature solder with improved bismuth substitution prevention performance | HOJIN PLATECH CO., LTD. (KR) | 2024-08-27 | — | — | US | claimed |
| US-20240167183-A1 | ELECTROPLATING SOLUTION FOR INDIUM-BISMUTH ALLOY FOR LOW-TEMPERATURE SOLDER WITH IMPROVED BISMUTH SUBSTITUTION PREVENTION PERFORMANCE | HOJIN PLATECH CO., LTD. (KR) | 2024-05-23 | — | — | US | claimed |
| US-10889907-B2 | Cyanide-free acidic matte silver electroplating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2021-01-12 | — | — | US | claimed |
| EP-2071057-B1 | ELECTROPLATING COPPER-TIN ALLOY | ROHM & HAAS ELECT MAT (US) | 2019-01-23 | — | — | EP | claimed |
| EP-3004429-B1 | ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS | ROHM & HAAS ELECT MAT (US) | 2018-07-18 | — | — | EP | claimed |
| US-9512529-B2 | Electroplating baths of silver and tin alloys | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2016-12-06 | — | — | US | claimed |
| US-7780839-B2 | Electroplating bronze | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2010-08-24 | — | — | US | claimed |
| CN-120138738-A | Electronic plating cobalt additive composition for hole filling and application thereof | 厦门大学 | 2025-06-13 | — | — | CN | disclosed |
| US-12071703-B2 | Electroplating solution for indium-bismuth alloy for low-temperature solder with improved bismuth substitution prevention performance | HOJIN PLATECH CO., LTD. (KR) | 2024-08-27 | — | — | US | disclosed |
| US-20240167183-A1 | ELECTROPLATING SOLUTION FOR INDIUM-BISMUTH ALLOY FOR LOW-TEMPERATURE SOLDER WITH IMPROVED BISMUTH SUBSTITUTION PREVENTION PERFORMANCE | HOJIN PLATECH CO., LTD. (KR) | 2024-05-23 | — | — | US | disclosed |
| EP-4370732-A1 | ELECTROPLATING COMPOSITIONS AND METHODS FOR PREPARING THE SAME | Seolfor Aktiebolag (SE) | 2024-05-22 | — | — | EP | disclosed |
| US-11879181-B2 | Electroplating solution of tin or tin alloy with improved thickness variation of wafer bumps | HOJIN PLATECH CO., LTD. (KR) | 2024-01-23 | — | — | US | disclosed |
| CN-110176441-B | Copper pillars with improved integrity and method of making same | 罗门哈斯电子材料有限责任公司 | 2023-08-01 | — | — | CN | disclosed |
| EP-0420005-A1 | high contrast silver halide photographic material | FUJI PHOTO FILM CO., LTD. (JP) | 1991-04-03 | — | — | EP | disclosed |
| EP-0398285-A2 | Silver halide photographic materials | FUJI PHOTO FILM CO., LTD. (JP) | 1990-11-22 | — | — | EP | disclosed |
| EP-0395069-A2 | Silver halide photographic materials | FUJI PHOTO FILM CO., LTD. (JP) | 1990-10-31 | — | — | EP | disclosed |
| EP-0393720-A2 | Silver halide photographic materials | FUJI PHOTO FILM CO., LTD. (JP) | 1990-10-24 | — | — | EP | disclosed |
| EP-0335319-A2 | Silver halide photographic material | FUJI PHOTO FILM CO., LTD. (JP) | 1989-10-04 | — | — | EP | disclosed |
| US-4737442-A | INCLUDING A SENSITIZER AND A BLOCKED DEVELOPMENT RESTRAINER; FREE OF BLACK SPOTS | FUJI PHOTO FILM CO., LTD. (JP) | 1988-04-12 | — | — | US | disclosed |