Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.41 |
| ▸ | PAM | P19021 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | NPC1 | O15118 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.39 |
| ▸ | RAB9A | P51151 | 1/20 | 0.39 |
| ▸ | RECQL | P46063 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 2/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | MAPK8 | P45983 | 1/20 | 0.37 |
| ▸ | MAPK9 | P45984 | 1/20 | 0.37 |
| ▸ | MAPK10 | P53779 | 1/20 | 0.37 |
| ▸ | CES2 | O00748 | 1/20 | 0.37 |
| ▸ | CES1 | P23141 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28523619 | 0.86 | SMN1; SMN2 (0.37) | L3MBTL1PAMSMN1; SMN2ALDH1A1NPC1 | |
| SCHEMBL29914240 | 0.81 | ALDH1A1 (0.44) | L3MBTL1PAMSMN1; SMN2ALDH1A1RECQL | |
| SCHEMBL1496868 | 0.78 | PLA2G7 (0.45) | L3MBTL1SMN1; SMN2NPC1HPGDRAB9A | |
| SCHEMBL27836929 | 0.72 | ALDH1A1 (0.49) | SMN1; SMN2ALDH1A1NPC1MEN1KMT2A | |
| SCHEMBL13538631 | 0.71 | ALDH1A1 (0.53) | L3MBTL1SMN1; SMN2ALDH1A1NPC1RAB9A | |
| SCHEMBL3770638 | 0.71 | USP2 (0.57) | L3MBTL1SMN1; SMN2ALDH1A1NPC1HPGD | |
| SCHEMBL3770635 | 0.71 | USP2 (0.57) | L3MBTL1SMN1; SMN2ALDH1A1NPC1HPGD | |
| SCHEMBL16681457 | 0.70 | SOAT1 (0.48) | L3MBTL1PAMSMN1; SMN2ALDH1A1RECQL | |
| SCHEMBL10675618 | 0.70 | ALDH1A1 (0.55) | L3MBTL1PAMSMN1; SMN2ALDH1A1RECQL | |
| SCHEMBL8949906 | 0.70 | MAPT (0.47) | L3MBTL1PAMSMN1; SMN2ALDH1A1MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 81 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2809695-B1 | SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME | DOW GLOBAL TECHNOLOGIES LLC (US) | 2024-03-13 | — | — | EP | disclosed |
| US-10903381-B2 | Electronic device module | YPAREX B.V. (NL) | 2021-01-26 | — | — | US | disclosed |
| EP-3248224-B1 | ELECTRONIC DEVICE MODULE | YPAREX B V (NL) | 2020-12-23 | — | — | EP | disclosed |
| US-10872990-B2 | Electronic devices comprising two encapsulant films | DOW GLOBAL TECHNOLOGIES LLC (US) | 2020-12-22 | — | — | US | disclosed |
| EP-3212700-B1 | PV MODULE WITH FILM LAYER COMPRISING MICRONIZED SILICA GEL | DOW GLOBAL TECHNOLOGIES LLC (US) | 2019-08-14 | — | — | EP | disclosed |
| CN-105713144-B | The co-crosslinker system for packaging film comprising bis- (eneamide) compounds | 赢创德固赛有限公司 | 2019-08-06 | — | — | CN | disclosed |
| CN-105713146-B | The co-crosslinker system for packaging film comprising (methyl) acrylamide compound | 赢创德固赛有限公司 | 2019-06-21 | — | — | CN | disclosed |
| US-20190140122-A1 | Electronic Devices Comprising Two Encapsulant Films | DOW GLOBAL TECHNOLOGIES LLC | 2019-05-09 | — | — | US | disclosed |
| US-10233275-B2 | Co-crosslinker systems for encapsulation films comprising BIS(alkenylamide) compounds | EVONIK DEGUSSA GMBH (DE) | 2019-03-19 | — | — | US | disclosed |
| US-10164137-B2 | Electronic devices comprising two encapsulant films | DOW GLOBAL TECHNOLOGIES LLC (US) | 2018-12-25 | — | — | US | disclosed |
| US-20110290317-A1 | ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER WITH LOW UNSATURATION AND OPTIONAL VINYL SILANE | NAUMOVITZ JOHN (US) | 2011-12-01 | — | — | US | disclosed |
| EP-2070127-B1 | ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER | DOW GLOBAL TECHNOLOGIES INC (US) | 2010-05-26 | — | — | EP | disclosed |
| WO-2009085814-A2 | COMPOSITIONS USEFUL FOR PREPARING FOAMED ARTICLES FROM LOW MELT INDEX RESINS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2009-07-09 | — | — | WO | disclosed |
| EP-2070127-A2 | ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER | Dow Global Technologies Inc. (US) | 2009-06-17 | — | — | EP | disclosed |
| EP-2067175-A2 | ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER | Dow Global Technologies Inc. (US) | 2009-06-10 | — | — | EP | disclosed |
| US-20080115825-A1 | Electronic Device Module Comprising an Ethylene Multi-Block Copolymer | DOW GLOBAL TECHNOLOGIES LLC | 2008-05-22 | — | — | US | disclosed |
| US-20080078445-A1 | Electronic Device Module Comprising Polyolefin Copolymer | DOW GLOBAL TECHNOLOGIES LLC | 2008-04-03 | — | — | US | disclosed |
| WO-2008036708-A2 | ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER | DOW GLOBAL TECHNOLOGIES INC. (US) | 2008-03-27 | — | — | WO | disclosed |
| WO-2008036707-A2 | ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER | DOW GLOBAL TECHNOLOGIES INC. (US) | 2008-03-27 | — | — | WO | disclosed |
| US-20020000290-A1 | Curing of a gel coat on a mold | COOK COMPOSITES AND POLYMERS CO. | 2002-01-03 | — | — | US | disclosed |