SCHEMBL30102585

SCHEMBL30102585

C=Cc1cc(CCCCCC)c(C=C)cc1CCCCCC

nearest known ligand 0.43

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALOX5 P09917 3/20 0.43
MEN1 O00255 2/20 0.43
KMT2A Q03164 2/20 0.43
TP53 P04637 1/20 0.43
CYP3A4 P08684 1/20 0.43
MAPT P10636 1/20 0.43
TYR P14679 1/20 0.43
ALOX15 P16050 1/20 0.43
TSHR P16473 1/20 0.43
HTT P42858 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
THRA P10827 3/20 0.41
THRB P10828 3/20 0.41
LIPG Q9Y5X9 1/20 0.40
GPR84 Q9NQS5 8/20 0.40
PTGS2 P35354 4/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7525439 1.00 ALOX5 (0.43) ALOX5MEN1KMT2ATP53CYP3A4
SCHEMBL4234613 1.00 ALOX5 (0.43) ALOX5MEN1KMT2ATP53CYP3A4
SCHEMBL12802062 0.96 ALOX5 (0.41) ALOX5MEN1KMT2ATP53CYP3A4
SCHEMBL12802116 0.94 CYP3A4 (0.38) ALOX5MEN1KMT2ATP53CYP3A4
SCHEMBL30102586 0.91 TYR (0.39) ALOX5MEN1KMT2ATP53CYP3A4
SCHEMBL4235630 0.89 GPR84 (0.37) ALOX5MEN1KMT2ATP53CYP3A4
SCHEMBL12802284 0.88 TYR (0.37) ALOX5MEN1KMT2ATP53CYP3A4
SCHEMBL5078061 0.82 MEN1 (0.40) ALOX5MEN1KMT2ATP53CYP3A4
SCHEMBL1031286 0.82 THRA (0.46) ALOX5MEN1KMT2ATP53CYP3A4
SCHEMBL15874933 0.82 TLR8 (0.48) MEN1KMT2ATP53CYP3A4THRA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120092029-A Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board 三菱瓦斯化学株式会社 2025-06-03 CN disclosed
CN-116891635-A Curable composition, cured product, prepreg, circuit board, laminated film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116891633-A Curable composition, cured product, prepreg, circuit board, laminate film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116891634-A Curable composition, cured product, prepreg, circuit board, laminated film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116891632-A Curable composition, cured product, prepreg, circuit board, laminate film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116135901-A Epoxy resin DIC株式会社 2023-05-19 CN disclosed
CN-115558104-A Polymaleimide compound, curable composition, cured product, prepreg, circuit board, and build-up film DIC株式会社 2023-01-03 CN disclosed