SCHEMBL30102586

SCHEMBL30102586

C=Cc1cc(CCCC)c(C=C)cc1CCCC

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TYR P14679 2/20 0.39
THRA P10827 2/20 0.35
THRB P10828 2/20 0.35
TSHR P16473 2/20 0.33
HTT P42858 2/20 0.33
CYP3A4 P08684 2/20 0.33
FFAR3 O14843 2/20 0.33
HCAR2 Q8TDS4 2/20 0.33
ALDH1A1 P00352 1/20 0.33
TLR8 Q9NR97 1/20 0.33
HCAR3 P49019 1/20 0.33
MEN1 O00255 1/20 0.33
TP53 P04637 1/20 0.33
ALOX5 P09917 1/20 0.33
MAPT P10636 1/20 0.33
ALOX15 P16050 1/20 0.33
KMT2A Q03164 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
NPC1 O15118 1/20 0.33
HPGD P15428 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12802284 0.96 TYR (0.37) TYRTHRATHRBTSHRHTT
SCHEMBL30102585 0.91 ALOX5 (0.43) TYRTHRATHRBTSHRHTT
SCHEMBL4234613 0.91 ALOX5 (0.43) TYRTHRATHRBTSHRHTT
SCHEMBL7525439 0.91 ALOX5 (0.43) TYRTHRATHRBTSHRHTT
SCHEMBL12802116 0.90 CYP3A4 (0.38) TYRTHRATHRBTSHRHTT
SCHEMBL12802062 0.88 ALOX5 (0.41) TYRTHRATHRBTSHRHTT
SCHEMBL1148630 0.82 NPC1 (0.36) TYRTHRATHRBHTTNPC1
SCHEMBL12802350 0.82 HMGCR (0.31)
SCHEMBL4235630 0.82 GPR84 (0.37) TYRTHRATHRBTSHRHTT
SCHEMBL12802098 0.81 THRA (0.44) THRATHRBHTTCYP3A4TLR8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120092029-A Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board 三菱瓦斯化学株式会社 2025-06-03 CN disclosed
CN-116891635-A Curable composition, cured product, prepreg, circuit board, laminated film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116891633-A Curable composition, cured product, prepreg, circuit board, laminate film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116891634-A Curable composition, cured product, prepreg, circuit board, laminated film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116891632-A Curable composition, cured product, prepreg, circuit board, laminate film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116135901-A Epoxy resin DIC株式会社 2023-05-19 CN disclosed
CN-115558104-A Polymaleimide compound, curable composition, cured product, prepreg, circuit board, and build-up film DIC株式会社 2023-01-03 CN disclosed