Imidazole

Imidazole

SCHEMBL30112751

O=C(O)c1ccc(C(=O)O)c(C(=O)O)c1.c1c[nH]cn1

nearest known ligand 0.47

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 6/20 0.47
HSD17B10 Q99714 3/20 0.45
CDC25A P30304 1/20 0.45
CDC25B P30305 1/20 0.45
POLB P06746 4/20 0.44
L3MBTL1 Q9Y468 3/20 0.44
TDP1 Q9NUW8 2/20 0.44
ALDH1A1 P00352 4/20 0.42
FKBP5 Q13451 1/20 0.42
MYC P01106 1/20 0.37
NAPRT Q6XQN6 1/20 0.37
HPGD P15428 1/20 0.37
ENPP2 Q13822 1/20 0.37
APEX1 P27695 2/20 0.36
CTDSP1 Q9GZU7 1/20 0.36
LMNA P02545 1/20 0.36
RAB9A P51151 1/20 0.36
MAPT P10636 2/20 0.36
KDM6B O15054 1/20 0.36
TET3 O43151 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Imidazole SCHEMBL6053658 1.00 KDM4E (0.47) KDM4EHSD17B10CDC25ACDC25BPOLB
Imidazole SCHEMBL3835971 1.00 KDM4E (0.47) KDM4EHSD17B10CDC25ACDC25BPOLB
Benzene SCHEMBL28264459 0.98 KDM4E (0.50) KDM4EHSD17B10CDC25ACDC25BPOLB
Imidazole SCHEMBL6061843 0.87 KDM4E (0.43) KDM4EHSD17B10CDC25ACDC25BL3MBTL1
Pyromellitic Acid SCHEMBL28544009 0.84 ALDH1A1 (0.54) KDM4EL3MBTL1TDP1ALDH1A1FKBP5
Terephthalic Acid SCHEMBL10576128 0.84 ALDH1A1 (0.54) KDM4EALDH1A1FKBP5NAPRTHPGD
Terephthalic Acid SCHEMBL10576133 0.84 ALDH1A1 (0.54) KDM4EALDH1A1FKBP5NAPRTHPGD
Isophthalic Acid SCHEMBL15234293 0.81 KMO (0.47) KDM4EHSD17B10L3MBTL1TDP1ALDH1A1
Phthalic Acid SCHEMBL30474600 0.81 ALDH1A1 (0.54) KDM4EHSD17B10CDC25ACDC25BPOLB
Phthalic Acid SCHEMBL2196835 0.81 ALDH1A1 (0.54) KDM4EHSD17B10CDC25ACDC25BPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230392002-A1 METHOD FOR EVALUATING COMPATIBILITY OF THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORPORATION (JP) 2023-12-07 US disclosed
CN-110662795-B Prepreg, method for producing same, laminate, printed wiring board, and semiconductor package 昭和电工材料株式会社 2022-12-06 CN disclosed