Imidazole

Imidazole

SCHEMBL3835971

O=C(O)c1ccc(C(=O)O)c(C(=O)O)c1.c1c[nH]cn1

nearest known ligand 0.47

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 6/20 0.47
HSD17B10 Q99714 3/20 0.45
CDC25A P30304 1/20 0.45
CDC25B P30305 1/20 0.45
POLB P06746 4/20 0.44
L3MBTL1 Q9Y468 3/20 0.44
TDP1 Q9NUW8 2/20 0.44
ALDH1A1 P00352 4/20 0.42
FKBP5 Q13451 1/20 0.42
MYC P01106 1/20 0.37
NAPRT Q6XQN6 1/20 0.37
HPGD P15428 1/20 0.37
ENPP2 Q13822 1/20 0.37
APEX1 P27695 2/20 0.36
CTDSP1 Q9GZU7 1/20 0.36
LMNA P02545 1/20 0.36
RAB9A P51151 1/20 0.36
MAPT P10636 2/20 0.36
KDM6B O15054 1/20 0.36
TET3 O43151 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Imidazole SCHEMBL6053658 1.00 KDM4E (0.47) KDM4EHSD17B10CDC25ACDC25BPOLB
Imidazole SCHEMBL30112751 1.00 KDM4E (0.47) KDM4EHSD17B10CDC25ACDC25BPOLB
Benzene SCHEMBL28264459 0.98 KDM4E (0.50) KDM4EHSD17B10CDC25ACDC25BPOLB
Imidazole SCHEMBL6061843 0.87 KDM4E (0.43) KDM4EHSD17B10CDC25ACDC25BL3MBTL1
Pyromellitic Acid SCHEMBL28544009 0.84 ALDH1A1 (0.54) KDM4EL3MBTL1TDP1ALDH1A1FKBP5
Terephthalic Acid SCHEMBL10576128 0.84 ALDH1A1 (0.54) KDM4EALDH1A1FKBP5NAPRTHPGD
Terephthalic Acid SCHEMBL10576133 0.84 ALDH1A1 (0.54) KDM4EALDH1A1FKBP5NAPRTHPGD
Isophthalic Acid SCHEMBL15234293 0.81 KMO (0.47) KDM4EHSD17B10L3MBTL1TDP1ALDH1A1
Phthalic Acid SCHEMBL30474600 0.81 ALDH1A1 (0.54) KDM4EHSD17B10CDC25ACDC25BPOLB
Phthalic Acid SCHEMBL2196835 0.81 ALDH1A1 (0.54) KDM4EHSD17B10CDC25ACDC25BPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 111 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109280523-A Epoxy sealing glue 东莞市沅邦电子材料有限公司 2019-01-29 CN claimed
CN-108530836-A A kind of low temperature reinforcement liner plate composite material and its low temperature reinforcement liner plate 浙江吉利汽车有限公司 2018-09-14 CN claimed
CN-100422235-C Electric insulated resin pulp used for chip carrying and packaging PING LIU (CN) 2008-10-01 CN claimed
CN-1610103-A Electric insulated resin pulp used for chip carrying and packaging LIU PING (CN) 2005-04-27 CN claimed
JP-63193969-A None JP disclosed
CN-110461887-A Cured film is formed with composition, orientation material and phase difference material NISSAN CHEMICAL CORP 2019-11-15 CN disclosed
CN-110461964-A Cured film is formed with composition, orientation material and phase difference material NISSAN CHEMICAL CORP 2019-11-15 CN disclosed
CN-109790318-A Manufacturing method, aeroge complex and the insulated body of aeroge complex 日立化成株式会社 2019-05-21 CN disclosed
CN-105348457-B Organic-inorganic composite body and its manufacturing method, organic/inorganic composite film and its manufacturing method, photonic crystal, coating material 旭化成株式会社 2019-04-26 CN disclosed
CN-105924637-B A method of polyoxyalkylene polymers of the production containing crosslinkable silyl 陶氏环球技术有限责任公司 2019-04-19 CN disclosed
CN-109496341-A Method for inhibiting generation of creeping discharge 日产化学株式会社 2019-03-19 CN disclosed
CN-105947997-B Boron nitride agglomerated particles, composition containing the same, and three-dimensional integrated circuit having layer containing the composition 三菱化学株式会社 2018-12-21 CN disclosed
US-6916865-B2 Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins NIKKO MATERIALS CO., LTD. (JP) 2005-07-12 US disclosed
CN-1610103-A Electric insulated resin pulp used for chip carrying and packaging LIU PING (CN) 2005-04-27 CN disclosed
CN-1599742-A Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins NIKKO MATERIALS CO LTD (JP) 2005-03-23 CN disclosed
EP-1452536-A1 ORGANIC CARBOXYLIC ACID SALT COMPOSITION, PROCESS FOR PREPARATION THEREOF AND ADDITIVES FOR EPOXY RESINS Nikko Materials Company, Limited (JP) 2004-09-01 EP disclosed
US-20040077751-A1 Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins JX NIPPON MINING & METALS CORPORATION (JP) 2004-04-22 US disclosed
CN-1089356-C Adhesive, adhesive film and adhesive-backed metal foll HITACHI CHEMICAL CO LTD (JP) 2002-08-21 CN disclosed
CN-1180368-A Adhesive, adhesive film and metal foil with adhesive bottom surface HITACHI CHEMICAL CO LTD (JP) 1998-04-29 CN disclosed
JP-S63193969-A EPOXY RESIN POWDER COATING SUITABLE FOR COIL FIXATION SOMAR CORP 1988-08-11 JP disclosed