Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 12/20 | 0.58 |
| ▸ | FAAH | O00519 | 4/20 | 0.51 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.44 |
| ▸ | PKM | P14618 | 1/20 | 0.44 |
| ▸ | HTT | P42858 | 1/20 | 0.44 |
| ▸ | ATM | Q13315 | 1/20 | 0.44 |
| ▸ | NPC1 | O15118 | 1/20 | 0.43 |
| ▸ | POLB | P06746 | 1/20 | 0.43 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.43 |
| ▸ | RAB9A | P51151 | 1/20 | 0.43 |
| ▸ | HPN | P05981 | 1/20 | 0.41 |
| ▸ | G6PD | P11413 | 1/20 | 0.38 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.38 |
| ▸ | ADAMTS5 | Q9UNA0 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL486609 | 1.00 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL487163 | 1.00 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29573306 | 1.00 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29573130 | 0.96 | MGLL (0.54) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL486784 | 0.96 | MGLL (0.54) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL11940262 | 0.90 | MGLL (0.59) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL9491223 | 0.87 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29754402 | 0.87 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL487151 | 0.87 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29391228 | 0.87 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119490747-A | Resin composition, prepreg comprising same, laminated board and metal foil-clad laminated board | 广东生益科技股份有限公司 | 2025-02-21 | — | — | CN | claimed |
| CN-116410595-B | Resin composition, prepreg comprising same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2025-02-14 | — | — | CN | claimed |
| CN-116410596-B | Resin composition and application thereof | 广东生益科技股份有限公司 | 2025-02-14 | — | — | CN | claimed |
| CN-118240342-A | Thermosetting resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-116410594-B | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2024-06-14 | — | — | CN | claimed |
| CN-116496199-A | Modified maleimide compound and application thereof | 广东生益科技股份有限公司 | 2023-07-28 | — | — | CN | claimed |
| CN-116410594-A | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410596-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410595-A | Resin composition, prepreg comprising same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| US-20250287499-A1 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2025-09-11 | — | — | US | disclosed |
| US-20250188263-A1 | RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-06-12 | — | — | US | disclosed |
| CN-119490747-A | Resin composition, prepreg comprising same, laminated board and metal foil-clad laminated board | 广东生益科技股份有限公司 | 2025-02-21 | — | — | CN | disclosed |
| CN-116410595-B | Resin composition, prepreg comprising same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2025-02-14 | — | — | CN | disclosed |
| CN-116410596-B | Resin composition and application thereof | 广东生益科技股份有限公司 | 2025-02-14 | — | — | CN | disclosed |
| CN-116410594-A | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | disclosed |
| CN-116410596-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | disclosed |
| CN-116410595-A | Resin composition, prepreg comprising same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | disclosed |
| WO-2023031987-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYERED PRINTED WIRING BOARD | 昭和電工マテリアルズ株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023026817-A1 | THERMOSETTING RESIN COMPOSITION AND HEAT CURED PRODUCT | ポリプラ・エボニック株式会社 | 2023-03-02 | — | — | WO | disclosed |
| WO-2023022094-A1 | CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING MULTILAYERED WIRING BOARD, AND MULTILAYERED WIRING BOARD | 昭和電工マテリアルズ株式会社 | 2023-02-23 | — | — | WO | disclosed |