SCHEMBL487163

SCHEMBL487163

CC(C)(c1ccc(Oc2cccc(N3C(=O)C=CC3=O)c2)cc1)c1ccc(Oc2cccc(N3C(=O)C=CC3=O)c2)cc1

nearest known ligand 0.58

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 12/20 0.58
FAAH O00519 4/20 0.51
HSP90AA1 P07900 3/20 0.49
ALDH1A1 P00352 1/20 0.44
PKM P14618 1/20 0.44
HTT P42858 1/20 0.44
ATM Q13315 1/20 0.44
NPC1 O15118 1/20 0.43
POLB P06746 1/20 0.43
CYP2C9 P11712 1/20 0.43
RAB9A P51151 1/20 0.43
HPN P05981 1/20 0.41
G6PD P11413 1/20 0.38
TLR9 Q9NR96 1/20 0.38
ADAMTS5 Q9UNA0 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL486609 1.00 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29573306 1.00 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30158445 1.00 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29573130 0.96 MGLL (0.54) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL486784 0.96 MGLL (0.54) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL11940262 0.90 MGLL (0.59) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL9491223 0.87 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29754402 0.87 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL487151 0.87 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29391228 0.87 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 164 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117645771-A Solvent-free high-low temperature resistant bulletproof composite matrix resin and preparation method thereof 上海鑫丰泰新材料科技有限公司 2024-03-05 CN claimed
EP-0451405-B1 Thermosetting resin composition MITSUI TOATSU CHEMICALS (JP) 1994-12-14 EP claimed
EP-0372775-B1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS (JP) 1994-05-18 EP claimed
EP-0342912-B1 THERMOSETTING RESIN COMPOSITIONS MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-05-12 EP claimed
US-5104962-A Also containing bismaleimide groups; toughness, heat resistance MITSUI TOATSU CHEMICALS, INC. (JP) 1992-04-14 US claimed
EP-0451405-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-10-16 EP claimed
US-5015674-A Polysiloxanes for sealing semiconductors, modified with acrylates MITSUI TOATSU CHEMICALS, INC. (JP) 1991-05-14 US claimed
US-4987207-A Toughness, flexibility, adhesion, heat resistance MITSUI TOATSU CHEMICALS, INC. (JP) 1991-01-22 US claimed
US-4968762-A IMPACT STRENGTH, TOUGHNESS, LOW WATER ABSORPTION MITSUI TOATSU CHEMICALS, INC. (JP) 1990-11-06 US claimed
EP-0372775-A1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-06-13 EP claimed
EP-0354033-A2 Resin compositions for sealing semiconductors MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-02-07 EP claimed
EP-0342912-A1 Thermosetting resin compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP claimed
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2026-03-12 US disclosed
US-20250326893-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-10-23 US disclosed
US-20250326929-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-10-23 US disclosed
WO-2025105439-A1 CURABLE COMPOSITION FOR PREPREG, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE 株式会社レゾナック 2025-05-22 WO disclosed
EP-0294931-A1 Self-lubricating thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-14 EP disclosed
EP-0294930-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-14 EP disclosed
EP-0288251-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-10-26 EP disclosed
EP-0253586-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-01-20 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE CD79B, C1R, TGFBR1 MGLL 3867/4885FAAH 4069/4885HSP90AA1 3849/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.