SCHEMBL30165005

SCHEMBL30165005

O=[PH]1Oc2c(-c3ccccc3)cccc2-c2ccccc21

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HNF4A P41235 1/20 0.33
ALDH1A1 P00352 5/20 0.32
HSD17B10 Q99714 3/20 0.32
HDAC4 P56524 1/20 0.32
HDAC2 Q92769 1/20 0.32
HDAC8 Q9BY41 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32
HPGD P15428 1/20 0.32
BCL2L1 Q07817 1/20 0.32
CYP2A6 P11509 1/20 0.32
MAPK1 P28482 1/20 0.32
PIM1 P11309 1/20 0.32
PLK4 O00444 1/20 0.32
MAPK9 P45984 1/20 0.32
LIMK1 P53667 1/20 0.32
CLK4 Q9HAZ1 1/20 0.32
AKT3 Q9Y243 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
BCAT2 O15382 1/20 0.32
PTGS2 P35354 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17201415 1.00 HNF4A (0.33) HNF4AALDH1A1HSD17B10HDAC4HDAC2
SCHEMBL28371512 0.87 KMT2A (0.33) ALDH1A1HPGDMAPK1TSHRLMNA
SCHEMBL28375638 0.82 HDAC7 (0.37) ALDH1A1HPGDMAPK1TSHRLMNA
SCHEMBL30594730 0.82 HDAC7 (0.37) ALDH1A1HPGDMAPK1TSHRLMNA
SCHEMBL7108086 0.82 PDCD1 (0.33) HNF4AALDH1A1HSD17B10HDAC4HDAC2
SCHEMBL28371515 0.81 NPC1 (0.35) ALDH1A1HSD17B10HPGDTSHR
SCHEMBL30165037 0.79 MYC (0.33) TSHR
SCHEMBL8570213 0.79 AHR (0.36) ALDH1A1HPGDCYP2A6TSHRLMNA
SCHEMBL29448798 0.79 AHR (0.36) ALDH1A1HPGDCYP2A6TSHRLMNA
SCHEMBL30594715 0.76 GABRA1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112898738-B Epoxy resin composition, prepreg, laminate, printed wiring board, and cured product using same 日铁化学材料株式会社 2024-03-22 CN disclosed
CN-110520433-B Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition, and cured product thereof 日铁化学材料株式会社 2023-12-05 CN disclosed
CN-109553756-B Method for producing phosphorus-containing epoxy resin 日铁化学材料株式会社 2023-09-29 CN disclosed
CN-110951048-B Phosphorus-containing hardener, epoxy resin composition, cured product, prepreg, and laminate 日铁化学材料株式会社 2023-09-29 CN disclosed
CN-112585189-B Epoxy resin composition, prepreg, laminated board, material for circuit board, cured product, and method for producing phosphorus-containing epoxy resin 日铁化学材料株式会社 2023-08-01 CN disclosed
CN-110194843-B Phosphorus-containing phenoxy resin, resin composition, material for circuit board, and cured product 日铁化学材料株式会社 2023-01-03 CN disclosed