Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MYC | P01106 | 1/20 | 0.33 |
| ▸ | NPC1 | O15118 | 1/20 | 0.32 |
| ▸ | CASP3 | P42574 | 1/20 | 0.32 |
| ▸ | RAB9A | P51151 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | SENP8 | Q96LD8 | 1/20 | 0.32 |
| ▸ | SENP7 | Q9BQF6 | 1/20 | 0.32 |
| ▸ | SENP6 | Q9GZR1 | 1/20 | 0.32 |
| ▸ | HTR7 | P34969 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | ACHE | P22303 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
| ▸ | NOTUM | Q6P988 | 1/20 | 0.30 |
| ▸ | DAO | P14920 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2430825 | 1.00 | MYC (0.33) | MYCNPC1CASP3RAB9ASMN1; SMN2 | |
| SCHEMBL28371515 | 0.91 | NPC1 (0.35) | MYCNPC1CASP3RAB9ASMN1; SMN2 | |
| SCHEMBL30594715 | 0.83 | GABRA1 (0.34) | — | |
| SCHEMBL2431409 | 0.81 | ELANE (0.33) | SMN1; SMN2CYP1A2 | |
| SCHEMBL28371512 | 0.80 | KMT2A (0.33) | NPC1RAB9ASMN1; SMN2TSHRKDM4E | |
| SCHEMBL7108192 | 0.80 | ACHE (0.33) | MYCACHEDAO | |
| SCHEMBL30164963 | 0.79 | FEN1 (0.36) | CYP1A2CYP2C19DAO | |
| SCHEMBL17201415 | 0.79 | HNF4A (0.33) | TSHR | |
| SCHEMBL8570213 | 0.79 | AHR (0.36) | NPC1RAB9ASMN1; SMN2TSHRNOTUM | |
| SCHEMBL29448798 | 0.79 | AHR (0.36) | NPC1RAB9ASMN1; SMN2TSHRNOTUM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112898738-B | Epoxy resin composition, prepreg, laminate, printed wiring board, and cured product using same | 日铁化学材料株式会社 | 2024-03-22 | — | — | CN | disclosed |
| CN-110520433-B | Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition, and cured product thereof | 日铁化学材料株式会社 | 2023-12-05 | — | — | CN | disclosed |
| CN-109553756-B | Method for producing phosphorus-containing epoxy resin | 日铁化学材料株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-110951048-B | Phosphorus-containing hardener, epoxy resin composition, cured product, prepreg, and laminate | 日铁化学材料株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-112585189-B | Epoxy resin composition, prepreg, laminated board, material for circuit board, cured product, and method for producing phosphorus-containing epoxy resin | 日铁化学材料株式会社 | 2023-08-01 | — | — | CN | disclosed |
| CN-110194843-B | Phosphorus-containing phenoxy resin, resin composition, material for circuit board, and cured product | 日铁化学材料株式会社 | 2023-01-03 | — | — | CN | disclosed |