Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTGS2 | P35354 | 1/20 | 0.33 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.32 |
| ▸ | KMO | O15229 | 1/20 | 0.31 |
| ▸ | PTPRC | P08575 | 1/20 | 0.31 |
| ▸ | PTPRF | P10586 | 1/20 | 0.31 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.31 |
| ▸ | CDC25B | P30305 | 1/20 | 0.31 |
| ▸ | STING1 | Q86WV6 | 1/20 | 0.31 |
| ▸ | PTPN5 | P54829 | 2/20 | 0.30 |
| ▸ | PTPN2 | P17706 | 1/20 | 0.30 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.30 |
| ▸ | S1PR5 | Q9H228 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2431986 | 1.00 | PTGS2 (0.33) | PTGS2PDK2KMOPTPRCPTPRF | |
| SCHEMBL2428996 | 0.87 | ACMSD (0.33) | PDK2KMO | |
| SCHEMBL2433451 | 0.84 | PTGS2 (0.39) | PTGS2PTPRCPTPRFPTPN1CDC25B | |
| SCHEMBL30594716 | 0.84 | PTGS2 (0.39) | PTGS2PTPRCPTPRFPTPN1CDC25B | |
| SCHEMBL2431396 | 0.83 | PTGS2 (0.33) | PTGS2PTPN5PTPN2 | |
| SCHEMBL2441507 | 0.83 | PDK2 (0.32) | PDK2PTPRCPTPRFPTPN1CDC25B | |
| SCHEMBL2434834 | 0.82 | PTGDR2 (0.31) | PTGS2PTPN1 | |
| SCHEMBL2436057 | 0.81 | KMO (0.30) | KMO | |
| SCHEMBL2428914 | 0.79 | PDK2 (0.38) | PDK2KMOPTPRCPTPRFPTPN1 | |
| SCHEMBL29202592 | 0.79 | KMO (0.36) | PTGS2PDK2KMOSTING1PTPN5 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112898738-B | Epoxy resin composition, prepreg, laminate, printed wiring board, and cured product using same | 日铁化学材料株式会社 | 2024-03-22 | — | — | CN | disclosed |
| CN-110520433-B | Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition, and cured product thereof | 日铁化学材料株式会社 | 2023-12-05 | — | — | CN | disclosed |
| CN-109553756-B | Method for producing phosphorus-containing epoxy resin | 日铁化学材料株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-110951048-B | Phosphorus-containing hardener, epoxy resin composition, cured product, prepreg, and laminate | 日铁化学材料株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-112585189-B | Epoxy resin composition, prepreg, laminated board, material for circuit board, cured product, and method for producing phosphorus-containing epoxy resin | 日铁化学材料株式会社 | 2023-08-01 | — | — | CN | disclosed |
| CN-110194843-B | Phosphorus-containing phenoxy resin, resin composition, material for circuit board, and cured product | 日铁化学材料株式会社 | 2023-01-03 | — | — | CN | disclosed |