SCHEMBL30187261

SCHEMBL30187261

Nc1ccc2c(c1)Oc1cc(N)ccc1C2(c1ccccc1)c1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 7/20 0.44
KMT2A Q03164 7/20 0.44
KDM4E B2RXH2 6/20 0.44
MEN1 O00255 6/20 0.44
ALDH1A1 P00352 6/20 0.44
SMN1; SMN2 Q16637 6/20 0.44
LMNA P02545 3/20 0.44
OPRK1 P41145 1/20 0.44
FTO Q9C0B1 1/20 0.40
NPC1 O15118 5/20 0.38
RAB9A P51151 4/20 0.38
CHEK1 O14757 1/20 0.35
PRKD3 O94806 1/20 0.35
MAP4K4 O95819 1/20 0.35
RET P07949 1/20 0.35
MET P08581 1/20 0.35
PDGFRA P16234 1/20 0.35
FLT1 P17948 1/20 0.35
LTK P29376 1/20 0.35
PRKX P51817 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3471424 1.00 MAPT (0.44) MAPTKMT2AKDM4EMEN1ALDH1A1
SCHEMBL22050411 0.92 HSD17B10 (0.42) MAPTKMT2AKDM4EMEN1ALDH1A1
SCHEMBL418120 0.82 MAPT (0.42) MAPTKMT2AKDM4EMEN1ALDH1A1
SCHEMBL22050403 0.82 MEN1 (0.42) MAPTKMT2AKDM4EMEN1ALDH1A1
SCHEMBL22051115 0.82 ALDH1A1 (0.47) MAPTKMT2AKDM4EMEN1ALDH1A1
SCHEMBL8984527 0.80 MAPT (0.52) MAPTKMT2AKDM4EMEN1ALDH1A1
SCHEMBL31672202 0.80 MAPT (0.52) MAPTKMT2AKDM4EMEN1ALDH1A1
SCHEMBL3472059 0.78 PDK2 (0.43) MAPTKMT2AKDM4EMEN1ALDH1A1
SCHEMBL30398085 0.78 PDK2 (0.43) MAPTKMT2AKDM4EMEN1ALDH1A1
SCHEMBL21189567 0.78 LMNA (0.31) MAPTKMT2AMEN1ALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118871514-A Resin composition for surface-modified material 住友电木株式会社 2024-10-29 CN disclosed
CN-116256946-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-06-13 CN disclosed
CN-116256943-A Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-06-13 CN disclosed
WO-2023054381-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC DEVICE AND LIGHT DEVICE 住友ベークライト株式会社 2023-04-06 WO disclosed
WO-2023021688-A1 PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE 住友ベークライト株式会社 2023-02-23 WO disclosed
WO-2023021684-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE 住友ベークライト株式会社 2023-02-23 WO disclosed