Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 7/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 7/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 6/20 | 0.44 |
| ▸ | MEN1 | O00255 | 6/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 6/20 | 0.44 |
| ▸ | LMNA | P02545 | 3/20 | 0.44 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.44 |
| ▸ | FTO | Q9C0B1 | 1/20 | 0.40 |
| ▸ | NPC1 | O15118 | 5/20 | 0.38 |
| ▸ | RAB9A | P51151 | 4/20 | 0.38 |
| ▸ | CHEK1 | O14757 | 1/20 | 0.35 |
| ▸ | PRKD3 | O94806 | 1/20 | 0.35 |
| ▸ | MAP4K4 | O95819 | 1/20 | 0.35 |
| ▸ | RET | P07949 | 1/20 | 0.35 |
| ▸ | MET | P08581 | 1/20 | 0.35 |
| ▸ | PDGFRA | P16234 | 1/20 | 0.35 |
| ▸ | FLT1 | P17948 | 1/20 | 0.35 |
| ▸ | LTK | P29376 | 1/20 | 0.35 |
| ▸ | PRKX | P51817 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30187261 | 1.00 | MAPT (0.44) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL22050411 | 0.92 | HSD17B10 (0.42) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL418120 | 0.82 | MAPT (0.42) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL22050403 | 0.82 | MEN1 (0.42) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL22051115 | 0.82 | ALDH1A1 (0.47) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL8984527 | 0.80 | MAPT (0.52) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL31672202 | 0.80 | MAPT (0.52) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL3472059 | 0.78 | PDK2 (0.43) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL30398085 | 0.78 | PDK2 (0.43) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL21189567 | 0.78 | LMNA (0.31) | MAPTKMT2AMEN1ALDH1A1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2092807-B1 | COMPOSITE ORGANIC ENCAPSULANTS | CDA PROC LTD LIABILITY COMPANY (US) | 2013-04-17 | — | — | EP | claimed |
| US-7745516-B2 | Composition of polyimide and sterically-hindered hydrophobic epoxy | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-06-29 | — | — | US | claimed |
| US-20090111948-A1 | Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2009-04-30 | — | — | US | claimed |
| EP-2027184-A2 | HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-02-25 | — | — | EP | claimed |
| EP-1943311-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I.Du pont de nemours and company (US) | 2008-07-16 | — | — | EP | claimed |
| WO-2007146382-A2 | HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-12-21 | — | — | WO | claimed |
| US-20070290379-A1 | Hydrophobic compositions for electronic applications | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | claimed |
| WO-2007047384-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-04-26 | — | — | WO | claimed |
| US-20070083016-A1 | Photosensitive polyimide compositions | E. I. DUPONT DE NEMOURS AND COMPANY | 2007-04-12 | — | — | US | claimed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | claimed |
| WO-2025100302-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2025-05-15 | — | — | WO | disclosed |
| US-20250138422-A1 | PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2025-05-01 | — | — | US | disclosed |
| WO-2024204317-A1 | RESIN COMPOSITION, FILM, FILM SET, OPTICAL WAVEGUIDE, PHOTOELECTRIC COMPOSITE SUBSTRATE, AND ELECTRONIC COMPONENT | 住友ベークライト株式会社 | 2024-10-03 | — | — | WO | disclosed |
| CN-116256946-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-06-13 | — | — | CN | disclosed |
| CN-116256943-A | Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-06-13 | — | — | CN | disclosed |
| US-20070291440-A1 | Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | disclosed |
| US-20070290379-A1 | Hydrophobic compositions for electronic applications | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | disclosed |
| WO-2007047384-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-04-26 | — | — | WO | disclosed |
| US-20070083016-A1 | Photosensitive polyimide compositions | E. I. DUPONT DE NEMOURS AND COMPANY | 2007-04-12 | — | — | US | disclosed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | disclosed |