SCHEMBL3035977

SCHEMBL3035977

Oc1ccc(C2(c3ccc(O)cc3)C=CCC2)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 6/20 0.45
ESR1 P03372 4/20 0.45
KDM4E B2RXH2 1/20 0.35
MEN1 O00255 1/20 0.35
NPC1 O15118 1/20 0.35
CA12 O43570 1/20 0.35
GMNN O75496 1/20 0.35
ALDH1A1 P00352 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
LMNA P02545 1/20 0.35
CA3 P07451 1/20 0.35
CYP3A4 P08684 1/20 0.35
MAPT P10636 1/20 0.35
TYR P14679 1/20 0.35
HPGD P15428 1/20 0.35
ALOX15 P16050 1/20 0.35
NFKB1 P19838 1/20 0.35
CA4 P22748 1/20 0.35
CA5A P35218 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5598119 0.88 ESR2 (0.47) ESR2ESR1KDM4EMEN1NPC1
SCHEMBL29418154 0.84 ESR2 (0.52) ESR2ESR1ALDH1A1MMP2MMP9
SCHEMBL5968850 0.70 ESR2 (0.56) ESR2ESR1KDM4EMEN1NPC1
SCHEMBL28146651 0.68 ESR2 (0.39) ESR2ESR1KDM4EMEN1NPC1
SCHEMBL9104787 0.67 ALDH1A1 (0.45) KDM4EMEN1ALDH1A1LMNAMAPT
SCHEMBL9715308 0.67 ESR2 (0.42) ESR2ESR1KDM4EMEN1NPC1
SCHEMBL7530533 0.66 ESR2 (0.80) ESR2ESR1KDM4EMEN1NPC1
SCHEMBL3811364 0.66 ESR2 (0.80) ESR2ESR1KDM4EMEN1NPC1
SCHEMBL27184907 0.65 DPP4 (0.36)
SCHEMBL8925495 0.64 ESR2 (0.67) ESR2ESR1KDM4EMEN1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12098229-B2 Resin composition for plating, and plated molded article NIPPON A&L INC. (JP) 2024-09-24 US disclosed
US-20220251271-A1 RESIN COMPOSITION FOR PLATING, AND PLATED MOLDED ARTICLE NIPPON A&L INC. (JP) 2022-08-11 US disclosed
US-20190322786-A1 RESIN COMPOSITION FOR PLATING, AND PLATED MOLDED ARTICLE NIPPON A&L INC. (JP) 2019-10-24 US disclosed
US-8530123-B2 Electrophotographic photoreceptor, electrophotographic photoreceptor cartridge, and image-forming apparatus MITSUBISHI CHEMICAL CORPORATION (JP) 2013-09-10 US disclosed
US-8450032-B2 2013-05-28 US disclosed
US-20100330474-A1 ELECTROPHOTOGRAPHIC PHOTORECEPTOR, ELECTROPHOTOGRAPHIC PHOTORECEPTOR CARTRIDGE, AND IMAGE-FORMING APPARATUS MITSUBISHI CHEMICAL CORPORATION (JP) 2010-12-30 US disclosed
US-20100209136-A1 COATING FLUID FOR ELECTROPHOTOGRAPHIC PHOTORECEPTOR, ELECTROPHOTOGRAPHIC PHOTORECEPTOR, AND ELECTROPHOTOGRAPHIC- PHOTORECEPTOR CARTRIDGE MITSUBISHI CHEMICAL CORPORATION (JP) 2010-08-19 US disclosed