SCHEMBL30438702

SCHEMBL30438702

Oc1ccccc1-c1ccc2nnn(-c3ccccc3O)c2c1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNMA1 Q12791 4/20 0.63
QPCT Q16769 1/20 0.43
QPCTL Q9NXS2 1/20 0.43
DHODH Q02127 1/20 0.41
NT5E P21589 2/20 0.41
ESR2 Q92731 1/20 0.40
PIK3R1 P27986 1/20 0.39
PIK3CA P42336 1/20 0.39
KCNN4 O15554 1/20 0.38
ALDH1A1 P00352 1/20 0.37
HPGD P15428 1/20 0.37
BCL2L1 Q07817 1/20 0.37
HSD17B10 Q99714 1/20 0.37
BRD4 O60885 1/20 0.36
NR1I2 O75469 1/20 0.36
SMARCA2 P51531 1/20 0.36
SMARCA4 P51532 1/20 0.36
PBRM1 Q86U86 1/20 0.36
TDO2 P48775 2/20 0.36
GRM5 P41594 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL80393 0.78 KCNMA1 (1.00) KCNMA1ALDH1A1HPGD
SCHEMBL30567815 0.74 KCNMA1 (0.42) KCNMA1NT5EESR2TDO2
SCHEMBL5398396 0.72 KCNMA1 (0.68) KCNMA1DHODHKCNN4ALDH1A1HPGD
SCHEMBL10793086 0.71 QPCT (0.39) KCNMA1QPCTQPCTLDHODHESR2
SCHEMBL6064913 0.71 KCNMA1 (0.67) KCNMA1HPGD
SCHEMBL20820664 0.69 NPC1 (0.52) DHODHNT5EALDH1A1HPGDHSD17B10
SCHEMBL8764298 0.69 KCNMA1 (0.51) KCNMA1DHODHKCNN4ALDH1A1HPGD
SCHEMBL3969778 0.68 KCNMA1 (0.78) KCNMA1ALDH1A1HSD17B10
SCHEMBL9801804 0.67 KCNMA1 (0.71) KCNMA1ALDH1A1HSD17B10
SCHEMBL11880576 0.67 KCNMA1 (0.71) KCNMA1ALDH1A1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112334833-B Negative photosensitive resin composition, polyimide using same, and method for producing cured relief pattern 旭化成株式会社 2024-09-24 CN disclosed
CN-118363270-A Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2024-07-19 CN disclosed
CN-116609998-A Polyimide precursor, negative photosensitive resin composition, and method for producing cured relief pattern using same 旭化成株式会社 2023-08-18 CN disclosed
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed