SCHEMBL30469486

SCHEMBL30469486

Nc1ccc(C(=O)c2ccc(N)c(C(F)(F)F)c2)cc1C(F)(F)F

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
AR P10275 1/20 0.43
MAPT P10636 2/20 0.43
MAPK1 P28482 2/20 0.43
LMNA P02545 2/20 0.43
HTT P42858 2/20 0.43
GAA P10253 1/20 0.43
ALDH1A1 P00352 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
DDR1 Q08345 1/20 0.42
SRD5A2 P31213 2/20 0.42
FFAR4 Q5NUL3 6/20 0.42
VNN1 O95497 3/20 0.40
NPC1 O15118 1/20 0.40
USP2 O75604 1/20 0.40
RAB9A P51151 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
HSD17B10 Q99714 1/20 0.40
FFAR1 O14842 2/20 0.39
TSHR P16473 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3198016 1.00 AR (0.43) ARMAPTMAPK1LMNAHTT
SCHEMBL7190381 0.93 PTGS1 (0.41) ARMAPTMAPK1LMNAHTT
SCHEMBL7871444 0.91 PBRM1 (0.51) MAPTMAPK1LMNAHTTGAA
SCHEMBL7188882 0.88 PBRM1 (0.57) MAPTMAPK1LMNAHTTALDH1A1
SCHEMBL498590 0.86 CDC25B (0.50) ARMAPTLMNAHTTGAA
SCHEMBL29518166 0.86 CDC25B (0.50) ARMAPTLMNAHTTGAA
SCHEMBL6815102 0.86 AR (0.42) ARALDH1A1DDR1FFAR4VNN1
SCHEMBL7189576 0.86 SRD5A2 (0.43) MAPTALDH1A1DDR1SRD5A2FFAR4
SCHEMBL28503435 0.85 DDR1 (0.43) ARALDH1A1DDR1FFAR4RAB9A
SCHEMBL6315471 0.85 KIF11 (0.50) ARMAPTHTTDDR1FFAR4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4674897-A1 FILM, LAMINATE AND PRECURSOR COMPOSITION, AND COMPOSITION FOR LOWERING THERMAL EXPANSION COEFFICIENT OF POLYIMIDE RESIN I.S.T Corporation (JP) 2026-01-07 EP disclosed
CN-116367413-A Metal-clad laminate and circuit board 日铁化学材料株式会社 2023-06-30 CN disclosed