SCHEMBL3198016

SCHEMBL3198016

Nc1ccc(C(=O)c2ccc(N)c(C(F)(F)F)c2)cc1C(F)(F)F

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
AR P10275 1/20 0.43
MAPT P10636 2/20 0.43
MAPK1 P28482 2/20 0.43
LMNA P02545 2/20 0.43
HTT P42858 2/20 0.43
GAA P10253 1/20 0.43
ALDH1A1 P00352 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
DDR1 Q08345 1/20 0.42
SRD5A2 P31213 2/20 0.42
FFAR4 Q5NUL3 6/20 0.42
VNN1 O95497 3/20 0.40
NPC1 O15118 1/20 0.40
USP2 O75604 1/20 0.40
RAB9A P51151 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
HSD17B10 Q99714 1/20 0.40
FFAR1 O14842 2/20 0.39
TSHR P16473 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30469486 1.00 AR (0.43) ARMAPTMAPK1LMNAHTT
SCHEMBL7190381 0.93 PTGS1 (0.41) ARMAPTMAPK1LMNAHTT
SCHEMBL7871444 0.91 PBRM1 (0.51) MAPTMAPK1LMNAHTTGAA
SCHEMBL7188882 0.88 PBRM1 (0.57) MAPTMAPK1LMNAHTTALDH1A1
SCHEMBL498590 0.86 CDC25B (0.50) ARMAPTLMNAHTTGAA
SCHEMBL29518166 0.86 CDC25B (0.50) ARMAPTLMNAHTTGAA
SCHEMBL6815102 0.86 AR (0.42) ARALDH1A1DDR1FFAR4VNN1
SCHEMBL7189576 0.86 SRD5A2 (0.43) MAPTALDH1A1DDR1SRD5A2FFAR4
SCHEMBL28503435 0.85 DDR1 (0.43) ARALDH1A1DDR1FFAR4RAB9A
SCHEMBL6315471 0.85 KIF11 (0.50) ARMAPTHTTDDR1FFAR4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024181294-A1 FILM, LAMINATE AND PRECURSOR COMPOSITION, AND COMPOSITION FOR LOWERING THERMAL EXPANSION COEFFICIENT OF POLYIMIDE RESIN 株式会社アイ.エス.テイ 2024-09-06 WO disclosed
WO-2024071066-A1 METAL-CLAD LAMINATED PLATE 日鉄ケミカル&マテリアル株式会社 2024-04-04 WO disclosed
WO-2022230546-A1 POROUS POLYIMIDE FILM 東京応化工業株式会社 2022-11-03 WO disclosed
US-9688815-B2 Method for producing polyimide precursor and method for producing polyimide RICOH COMPANY, LTD. (JP) 2017-06-27 US disclosed
US-20160122474-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING POLYIMIDE RICHO COMPANY, LTD. (JP) 2016-05-05 US disclosed
EP-3004211-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING POLYIMIDE Ricoh Company, Ltd. (JP) 2016-04-13 EP disclosed
WO-2014192665-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING POLYIMIDE RICOH COMPANY, LTD. (JP) 2014-12-04 WO disclosed
US-20130161864-A1 SUBSTRATE STRUCTURE AND METHOD FOR MAKING THE SAME CHI MEI CORPORATION (TW) 2013-06-27 US disclosed
US-20120177425-A1 GLOSSY SURFACE FORMING APPARATUS AND GLOSSY SURFACE FORMING METHOD KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2012-07-12 US disclosed
US-20100329616-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR CONTROL OF REFRACTIVE INDEX, AND OPTICAL WAVEGUIDE AND OPTICAL COMPONENT USING THE SAME NEC CORPORATION (JP) 2010-12-30 US disclosed
US-5449584-A Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound SUMITOMO BAKELITE COMPANY, LTD. (JP) 1995-09-12 US disclosed
US-5401878-A Fluorinated unsaturated alkyl ether aryldiamines for polyimide polymers with heat resistance and waterproofing HITACHI CHEMICAL COMPANY, LTD. (JP) 1995-03-28 US disclosed
EP-0623830-A1 Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1994-11-09 EP disclosed
EP-0616234-A2 Polyimide optical waveguide and method of manufacturing the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1994-09-21 EP disclosed
US-5270438-A Fluorine-containing polyimides and precursors thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 1993-12-14 US disclosed
US-5194579-A Humidity and heat resistance; coatings for semiconductors, insulating films for wiring HITACHI, LTD. (JP) 1993-03-16 US disclosed
US-5108201-A From 3,3'-diamino-2,2'-bis(trifluoromethyl)biphenyl monomer NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1992-04-28 US disclosed
EP-0459395-A2 Positive photo-sensitive resin composition SUMITOMO BAKELITE COMPANY LIMITED (JP) 1991-12-04 EP disclosed
EP-0454590-A2 Polyimide optical waveguide NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1991-10-30 EP disclosed
EP-0450926-A2 Fluorine-containing polyimides and precursors thereof Hitachi Chemical Co., Ltd. (JP) 1991-10-09 EP disclosed