Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.41 |
| ▸ | F2 | P00734 | 1/20 | 0.38 |
| ▸ | F10 | P00742 | 1/20 | 0.38 |
| ▸ | F12 | P00748 | 1/20 | 0.38 |
| ▸ | F7 | P08709 | 1/20 | 0.38 |
| ▸ | F3 | P13726 | 1/20 | 0.38 |
| ▸ | PKM | P14618 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
| ▸ | BLM | P54132 | 1/20 | 0.37 |
| ▸ | PRSS1 | P07477 | 1/20 | 0.35 |
| ▸ | PRSS2 | P07478 | 1/20 | 0.35 |
| ▸ | C1S | P09871 | 1/20 | 0.35 |
| ▸ | PRSS3 | P35030 | 1/20 | 0.35 |
| ▸ | RECQL | P46063 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30960118 | 0.89 | ALDH1A1 (0.40) | ALDH1A1NPSR1KMT2AMEN1GAA | |
| SCHEMBL28899703 | 0.82 | ALDH1A1 (0.38) | ALDH1A1NPSR1F2F10F12 | |
| SCHEMBL28340625 | 0.82 | ALDH1A1 (0.47) | ALDH1A1NPSR1F2F10F12 | |
| SCHEMBL725723 | 0.80 | ALDH1A1 (0.36) | ALDH1A1NPSR1F2F10F12 | |
| SCHEMBL3056661 | 0.80 | ALDH1A1 (0.37) | ALDH1A1KMT2AMEN1MAPTHTT | |
| SCHEMBL11236179 | 0.80 | LMNA (0.41) | ALDH1A1L3MBTL1MAPTNPC1POLB | |
| SCHEMBL1741633 | 0.80 | LMNA (0.44) | ALDH1A1KMT2AMEN1L3MBTL1POLB | |
| SCHEMBL16799123 | 0.80 | IDO1 (0.36) | ALDH1A1KMT2AMEN1MAPTNPC1 | |
| SCHEMBL28899661 | 0.80 | ALDH1A1 (0.36) | ALDH1A1NPSR1F2F10F12 | |
| SCHEMBL28899758 | 0.80 | ALDH1A1 (0.37) | ALDH1A1NPSR1F2F10F12 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 168 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122012048-A | Composite resin plugging composition, and preparation method and application thereof | 中国石油化工股份有限公司 | 2026-05-12 | — | — | CN | claimed |
| CN-117264377-A | Low-viscosity high-heat-conductivity epoxy resin composition and preparation method thereof | 中欧电子材料国际创新中心(合肥)有限公司 | 2023-12-22 | — | — | CN | claimed |
| CN-105693141-B | A kind of preparation method of dielectric composite material for fingerprint sensor inductive layer | 天津德高化成新材料股份有限公司 | 2017-08-04 | — | — | CN | claimed |
| US-20170121520-A1 | DIELECTRIC COMPOSITE MATERIAL FOR FINGERPRINT SENSOR INDUCTION LAYER AND PREPARATION METHOD THEREOF | TECORE SYNCHEM INC. | 2017-05-04 | — | — | US | claimed |
| CN-105693141-A | Method for preparing dielectric composite material for induction layer of fingerprint sensor | 天津德高化成新材料股份有限公司 | 2016-06-22 | — | — | CN | claimed |
| WO-1999055813-A1 | IMPROVED UNCOMPLEXED CYCLODEXTRIN COMPOSITIONS FOR ODOR CONTROL | THE PROCTER & GAMBLE COMPANY (US) | 1999-11-04 | — | — | WO | claimed |
| JP-1187707-A | — | — | None | — | — | JP | disclosed |
| CN-122012048-A | Composite resin plugging composition, and preparation method and application thereof | 中国石油化工股份有限公司 | 2026-05-12 | — | — | CN | disclosed |
| CN-114262922-B | Processing technology of aluminum profile with high corrosion resistance | 广东润华轻合金有限公司 | 2024-06-18 | — | — | CN | disclosed |
| WO-2024033348-A1 | COMBINATION OF CATALYTIC COMPONENTS | POLYU GMBH (DE) | 2024-02-15 | — | — | WO | disclosed |
| US-20240002725-A1 | COMPOSITION AND METHOD FOR TREATING SUBSTRATE | FUJIFILM CORPORATION (JP) | 2024-01-04 | — | — | US | disclosed |
| CN-117264377-A | Low-viscosity high-heat-conductivity epoxy resin composition and preparation method thereof | 中欧电子材料国际创新中心(合肥)有限公司 | 2023-12-22 | — | — | CN | disclosed |
| EP-3719105-B1 | CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES | FUJIFILM ELECTRONIC MAT USA INC (US) | 2023-09-27 | — | — | EP | disclosed |
| EP-0470262-B1 | COPPER ALLOY COMPOSITION | ASAHI CHEMICAL IND (JP) | 1999-06-16 | — | — | EP | disclosed |
| CN-1042983-C | Compositions of cupric alloy | ASAHI CHEMICAL IND (JP) | 1999-04-14 | — | — | CN | disclosed |
| EP-0844272-A2 | Prepreg for laminate and process for producing printed wiring-board using the same | Ajinomoto Co., Ltd. (JP) | 1998-05-27 | — | — | EP | disclosed |
| WO-1997011105-A1 | EPOXY RESIN COMPOSITION FOR ELECTROLAMINATES HAVING ARYL SUBSTITUTED GUANIDINE AND/OR BIGUANIDE AS CROSS-LINKING AGENT | AKZO NOBEL N.V. (NL) | 1997-03-27 | — | — | WO | disclosed |
| US-5242511-A | COPPER ALLOY COMPOSITIONS | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1993-09-07 | — | — | US | disclosed |
| EP-0470262-A1 | COPPER ALLOY COMPOSITION | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1992-02-12 | — | — | EP | disclosed |
| JP-H01187707-A | COMPOSITION OF CONDUCTIVE RESIN PASTE | SUMITOMO METAL MINING CO LTD | 1989-07-27 | — | — | JP | disclosed |