SCHEMBL30610049

SCHEMBL30610049

CCCC1(CCC)c2cc(C(=O)Cc3ccccc3C)ccc2-c2ccc([N+](=O)[O-])cc21

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 6/20 0.39
▸ ALDH1A1 P00352 5/20 0.39
▸ MITF O75030 1/20 0.39
▸ LMNA P02545 1/20 0.39
▸ NPSR1 Q6W5P4 2/20 0.37
▸ MAOA P21397 2/20 0.37
▸ MAOB P27338 2/20 0.37
▸ CYP1A2 P05177 2/20 0.37
▸ CYP3A4 P08684 1/20 0.37
▸ CYP2D6 P10635 1/20 0.37
▸ CYP2C9 P11712 1/20 0.37
▸ CYP2C19 P33261 1/20 0.37
▸ HTT P42858 1/20 0.37
▸ SHBG P04278 1/20 0.37
▸ KMT2A Q03164 3/20 0.36
▸ MEN1 O00255 2/20 0.36
▸ THRB P10828 1/20 0.36
▸ SMN1; SMN2 Q16637 2/20 0.35
▸ NPC1 O15118 1/20 0.35
▸ RAB9A P51151 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18812917 0.86 SHBG (0.41) MAPTSHBGKMT2AMEN1
SCHEMBL17084348 0.83 SMN1; SMN2 (0.42) MAPTALDH1A1LMNANPSR1HTT
SCHEMBL17084362 0.80 MAPK1 (0.49) MAPTALDH1A1LMNAMAOAMAOB
SCHEMBL17084307 0.79 NPC1 (0.39) MAPTALDH1A1LMNAHTTKMT2A
SCHEMBL17084347 0.79 NPC1 (0.39) MAPTALDH1A1LMNAHTTKMT2A
SCHEMBL18812939 0.79 NPC1 (0.39) MAPTALDH1A1LMNAHTTKMT2A
SCHEMBL17084373 0.78 ALDH1A1 (0.36) MAPTALDH1A1NPSR1KMT2ATHRB
SCHEMBL12095383 0.77 PTPRC (0.45) MAPTALDH1A1LMNANPSR1CYP1A2
SCHEMBL18012636 0.77 ESPL1 (0.43) MAPTALDH1A1LMNANPSR1HTT
SCHEMBL18012756 0.77 MEN1 (0.43) MAPTALDH1A1LMNANPSR1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116893574-A Substrate with cured film, photosensitive resin composition, method for producing substrate with cured film, and display device 日铁化学材料株式会社 2023-10-17 — — CN disclosed
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