Known targets — ChEMBL curated mechanism
ABL1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB2AGTR1BCL2BCL2A1BCL2L1BCL2L10BCL2L2BCRBRAFCHRM1CHRNA10CHRNA9DRD1DRD2DRD3DRD4DRD5EGFRF2FLT1FLT4GCKGHSRGNRHRGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHTR1AHTR1BHTR1DHTR2AHTR2CHTR3AIDH2KDRKITMAOBMCL1MTTPPP4HBPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PIKFYVEROCK1ROCK2SLC18A2SLC6A2SLC6A3SLC6A4TACR1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8gyrAgyrBparCparEpol
The experimentally established mechanism targets of Tetrapentylammonium. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC22A1 | O15245 | 3/20 | 0.63 |
| ▸ | SLC22A2 | O15244 | 1/20 | 0.63 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.57 |
| ▸ | TP53 | P04637 | 1/20 | 0.57 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.57 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.57 |
| ▸ | TSHR | P16473 | 1/20 | 0.57 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.57 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.57 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.57 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.57 |
| ▸ | DNM1 | Q05193 | 6/20 | 0.52 |
| ▸ | LSS | P48449 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL331290 | 0.97 | SLC22A1 (0.65) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| SCHEMBL330618 | 0.97 | SLC22A1 (0.65) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Tetrahexylammonium SCHEMBL330698 | 0.97 | SLC22A1 (0.65) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| SCHEMBL330915 | 0.95 | SLC22A1 (0.62) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Tetrabuthylammonium SCHEMBL331035 | 0.95 | SLC22A1 (0.63) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Tetrabuthylammonium SCHEMBL31303421 | 0.92 | SLC22A1 (0.60) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Tetrapentylammonium SCHEMBL10945539 | 0.92 | SLC22A1 (0.67) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| SCHEMBL332024 | 0.91 | DNM1 (0.70) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| SCHEMBL331140 | 0.91 | DNM1 (0.70) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Tetrapentylammonium SCHEMBL6261128 | 0.90 | SLC22A1 (0.63) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230030598-A1 | EPOXY RESIN COMPOSITION, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2023-02-02 | — | — | US | disclosed |
| EP-4071214-A1 | EPOXY RESIN COMPOSITION, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL | Toray Industries, Inc. (JP) | 2022-10-12 | — | — | EP | disclosed |
| CN-114945631-A | Epoxy resin composition, molding material for fiber-reinforced composite material, and fiber-reinforced composite material | 东丽株式会社 | 2022-08-26 | — | — | CN | disclosed |
| WO-2021153584-A1 | EPOXY RESIN COMPOSITION, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL | 東レ株式会社 | 2021-08-05 | — | — | WO | disclosed |
| EP-3061793-B1 | ELECTRICALLY CONDUCTIVE COMPOSITION, ELECTRICAL CONDUCTOR, ELECTRICAL CONDUCTOR FORMATION METHOD, AND PRODUCTION METHOD FOR POLYMER | MITSUBISHI CHEM CORP (JP) | 2020-04-15 | — | — | EP | disclosed |
| CN-105637037-B | Conductive composition, conductor, method for forming conductor, and method for producing polymer | 三菱化学株式会社 | 2020-04-14 | — | — | CN | disclosed |
| EP-3061793-A1 | ELECTRICALLY CONDUCTIVE COMPOSITION, ELECTRICAL CONDUCTOR, ELECTRICAL CONDUCTOR FORMATION METHOD, AND PRODUCTION METHOD FOR POLYMER | Mitsubishi Rayon Co., Ltd. (JP) | 2016-08-31 | — | — | EP | disclosed |
| US-20160223910-A1 | CONDUCTIVE COMPOSITION, CONDUCTOR, METHOD FOR FORMING CONDUCTOR, AND METHOD FOR PRODUCING POLYMER | MITSUBISHI RAYON CO., LTD. (JP) | 2016-08-04 | — | — | US | disclosed |
| US-8093317-B2 | Antistatic thermoplastic resin composition and molded article composed thereof | TORAY INDUSTRIES, INC. (JP) | 2012-01-10 | — | — | US | disclosed |
| US-20090030122-A1 | ANTISTATIC THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE COMPOSED THEREOF | TORAY INDUSTRIES, INC. (JP) | 2009-01-29 | — | — | US | disclosed |
| EP-1985661-A1 | ANTISTATIC THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MADE FROM SAME | TORAY INDUSTRIES, INC. (JP) | 2008-10-29 | — | — | EP | disclosed |