SCHEMBL30634705

SCHEMBL30634705

Cc1ccccc1[P+](c1ccccc1C)(c1ccccc1C)c1ccccc1C

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.53
ACHE P22303 3/20 0.53
ALDH1A1 P00352 4/20 0.41
CA1 P00915 2/20 0.41
CA2 P00918 2/20 0.41
CA7 P43166 2/20 0.41
CA9 Q16790 2/20 0.41
ESR1 P03372 1/20 0.40
CYP3A4 P08684 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
CYP1A2 P05177 2/20 0.38
CYP2A6 P11509 2/20 0.38
LMNA P02545 1/20 0.35
ALOX12 P18054 1/20 0.35
MAPT P10636 1/20 0.35
HTT P42858 1/20 0.35
TAAR1 Q96RJ0 1/20 0.33
HSD17B10 Q99714 1/20 0.33
MAOA P21397 1/20 0.32
MAOB P27338 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL11444635 0.97 TSHR (0.50) TSHRACHEALDH1A1CA1CA2
Bromide SCHEMBL7873025 0.97 TSHR (0.50) TSHRACHEALDH1A1CA1CA2
Fluoride Ion SCHEMBL943596 0.97 TSHR (0.50) TSHRACHEALDH1A1CA1CA2
Water SCHEMBL4384424 0.97 TSHR (0.50) TSHRACHEALDH1A1CA1CA2
SCHEMBL7874669 0.94 TSHR (0.47) TSHRACHEALDH1A1CA1CA2
SCHEMBL7874600 0.87 ACHE (0.41) TSHRACHEALDH1A1CA1CA2
Phenol SCHEMBL7872892 0.85 TSHR (0.39) TSHRACHEALDH1A1CA1CA2
Bromide SCHEMBL7886102 0.82 TSHR (0.41) TSHRACHEALDH1A1CA1CA2
Bromide SCHEMBL9067697 0.77 TSHR (0.47) TSHRACHEALDH1A1CA1CA2
Iodide SCHEMBL9067572 0.77 TSHR (0.47) TSHRACHEALDH1A1CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4273624-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, INTERLAYER INSULATING FILM, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-08 EP disclosed
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed