SCHEMBL3071330

SCHEMBL3071330

NC(CCc1ccccc1)Oc1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
METAP2 P50579 1/20 0.47
METAP1 P53582 1/20 0.47
ANPEP P15144 2/20 0.46
ERAP1 Q9NZ08 2/20 0.46
ERAP2 Q6P179 1/20 0.46
PPARG P37231 5/20 0.45
PPARA Q07869 4/20 0.45
EPHX1 P07099 1/20 0.45
CYP2A6 P11509 1/20 0.41
HTR2A P28223 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
TAAR1 Q96RJ0 1/20 0.41
LOXL2 Q9Y4K0 1/20 0.41
F2 P00734 1/20 0.41
PRSS1 P07477 1/20 0.41
IDO1 P14902 1/20 0.41
TDO2 P48775 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Oxalic Acid SCHEMBL7318660 0.81 PPARG (0.66) PPARGPPARATAAR1
SCHEMBL28085523 0.79 HRH1 (0.46) EPHX1HTR2ATAAR1
SCHEMBL1569929 0.79 EPHX1 (0.60) ANPEPPPARGPPARAEPHX1CYP2A6
SCHEMBL10413016 0.79 PPARG (0.47) METAP2METAP1ANPEPERAP1ERAP2
SCHEMBL27638157 0.79 LNPEP (0.53) ERAP2PPARGPPARASMN1; SMN2LOXL2
Hydrochloric Acid SCHEMBL6963695 0.78 EPHX1 (0.58) ANPEPPPARGPPARAEPHX1CYP2A6
SCHEMBL5674229 0.78 ALDH1A1 (0.43) ANPEPPPARGPPARAEPHX1
SCHEMBL8081691 0.78 SCN4A (0.38) METAP2METAP1ANPEPPPARGPPARA
SCHEMBL3227309 0.78 SLC6A4 (0.41) PPARGPPARAEPHX1
SCHEMBL5679399 0.78 HDAC3 (0.39) ANPEPEPHX1TAAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023074534-A1 POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE 三井化学株式会社 2023-05-04 WO claimed
WO-2023008033-A1 POLYIMIDE FILM FOR GRAPHITE SHEET, GRAPHITE SHEET, AND METHOD FOR MANUFACTURING THESE 株式会社カネカ 2023-02-02 WO claimed
US-12564050-B2 Thermal substrates DUPONT ELECTRONICS, INC. 2026-02-24 US disclosed
US-20250237016-A1 REPELLENT DAIKIN INDUSTRIES, LTD. (JP) 2025-07-24 US disclosed
WO-2025127138-A1 COMPOSITION ダイキン工業株式会社 2025-06-19 WO disclosed
WO-2025127137-A1 COMPOSITION ダイキン工業株式会社 2025-06-19 WO disclosed
WO-2025127140-A1 COMPOSITION ダイキン工業株式会社 2025-06-19 WO disclosed
WO-2025094931-A1 PULP COMPOSITION ダイキン工業株式会社 2025-05-08 WO disclosed
WO-2025062833-A1 METHOD FOR MANUFACTURING PULP PRODUCT ダイキン工業株式会社 2025-03-27 WO disclosed
WO-2025004962-A1 REPELLENT ダイキン工業株式会社 2025-01-02 WO disclosed
WO-2024176902-A1 POWER-STORAGE-DEVICE AQUEOUS BINDER SOLUTION, POWER-STORAGE-DEVICE SLURRY, POWER-STORAGE-DEVICE ELECTRODE, POWER-STORAGE-DEVICE SEPARATOR, POWER-STORAGE-DEVICE SEPARATOR/ELECTRODE STACK, AND POWER STORAGE DEVICE 荒川化学工業株式会社 2024-08-29 WO disclosed
US-7026436-B2 Low temperature polyimide adhesive compositions and methods relating thereto E.I. DU PONT DE NEMOURS AND COMPANY (US) 2006-04-11 US disclosed
US-20060068211-A1 Low temperature polyimide adhesive compositions and methods relating thereto DUPONT ELECTRONICS, INC. 2006-03-30 US disclosed
US-20060068210-A1 Low temperature polyimide adhesive compositions and methods relating thereto DUPONT ELECTRONICS, INC. 2006-03-30 US disclosed
EP-1531657-A1 Multi-layer substrates having at least two dissimilar polyimide layers and a conductive layer, useful for electronics-type applications, and compositions relating thereto E. I. du Pont de Nemours and Company (US) 2005-05-18 EP disclosed
US-20050100719-A1 Vaiations in glass transition temperature between layers; electroconductive layer DUPONT ELECTRONICS, INC. 2005-05-12 US disclosed
EP-1424352-A1 Low temperature polymide adhesive compositions and methods relating thereto E.I.Du pont de nemours and company (US) 2004-06-02 EP disclosed
US-20040099374-A1 Low temperature polyimide adhesive compositions and methods relating thereto DUPONT ELECTRONICS, INC. 2004-05-27 US disclosed
EP-0322641-A2 Process for improving the adhesion of electrolessly plated metal layers to polyimide surfaces BAYER AG (DE) 1989-07-05 EP disclosed
US-3954709-A Phenylethyl group containing resins for the synthesis of peptides THE REGENTS OF THE UNIVERSITY OF COLORADO (US) 1976-05-04 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20250237016-A1 REPELLENT PRMT5, CHAT, DCXR METAP2 3429/4885METAP1 3001/4885ANPEP 1759/4885
US-12564050-B2 Thermal substrates TTN, AS3MT, SCO2 METAP2 4644/4885METAP1 4803/4885ANPEP 4743/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.