⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8644870 | 0.84 | RRM1 (0.36) | — | |
| SCHEMBL308611 | 0.84 | OPRM1 (0.39) | — | |
| SCHEMBL4984121 | 0.84 | — | — | |
| SCHEMBL10439956 | 0.84 | — | — | |
| SCHEMBL20041561 | 0.84 | TSHR (0.36) | — | |
| SCHEMBL27832222 | 0.82 | OPRM1 (0.37) | — | |
| SCHEMBL974525 | 0.82 | — | — | |
| SCHEMBL20875301 | 0.82 | OPRM1 (0.48) | — | |
| SCHEMBL30267032 | 0.80 | EPHX1 (0.42) | — | |
| SCHEMBL30266925 | 0.80 | EPHX1 (0.42) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10920179-B2 | Cleaning solution and method for cleaning substrate | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-02-16 | — | — | US | disclosed |
| US-20190256805-A1 | CLEANING SOLUTION AND METHOD FOR CLEANING SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-08-22 | — | — | US | disclosed |
| US-10119103-B2 | Cleaning liquid and method for cleaning | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-11-06 | — | — | US | disclosed |
| US-20170253840-A1 | CLEANING LIQUID AND METHOD FOR CLEANING | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-09-07 | — | — | US | disclosed |
| US-20150296646-A1 | PROTECTIVE PLATE AND DISPLAY DEVICE | SHARP KABUSHIKI KAISHA (JP) | 2015-10-15 | — | — | US | disclosed |
| US-8790990-B2 | Silica-based film forming material for formation of air gaps, and method for forming air gaps | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-07-29 | — | — | US | disclosed |
| US-8404786-B2 | Polymer and process for producing the same, composition for forming insulating film, and insulating film and method of forming the same | JSR CORPORATION (JP) | 2013-03-26 | — | — | US | disclosed |
| EP-1705208-B1 | COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING SAME, SILICA INSULATING FILM, AND METHOD FOR FORMING SAME | JSR CORP (JP) | 2013-03-20 | — | — | EP | disclosed |
| US-8318582-B2 | Method of forming a trench isolation | JSR CORPORATION (JP) | 2012-11-27 | — | — | US | disclosed |
| US-8093419-B2 | Method of producing organosilicon compound | JSR CORPORATION (JP) | 2012-01-10 | — | — | US | disclosed |
| US-20030157340-A1 | Process for producing silica-based film, silica-based film, insulating film, and semiconductor device | JSR CORPORATION (JP) | 2003-08-21 | — | — | US | disclosed |
| US-20020086167-A1 | Composition for film formation, method of film formation, and silica-based film | JSR CORPORATION (JP) | 2002-07-04 | — | — | US | disclosed |
| US-6413647-B1 | USEFUL AS INTERLAYER DIELECTRIC FILM IN SEMICONDUCTOR DEVICES; MECHANICAL STRENGTH | JSR CORPORATION (JP) | 2002-07-02 | — | — | US | disclosed |
| US-6410151-B1 | Composition for film formation, method of film formation, and insulating film | JSR CORPORATION (JP) | 2002-06-25 | — | — | US | disclosed |
| US-6410150-B1 | Composition for film formation, method of film formation, and insulating film | JSR CORPORATION (JP) | 2002-06-25 | — | — | US | disclosed |
| US-20010018129-A1 | Process for producing silica-based film, silica-based film, insulating film, and semiconductor device | JSR CORPORATION (JP) | 2001-08-30 | — | — | US | disclosed |
| EP-1127929-A2 | Composition for film formation, method of film formation, and silica-based film | JSR Corporation (JP) | 2001-08-29 | — | — | EP | disclosed |
| EP-1122770-A2 | Silica-based insulating film and its manufacture | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |
| EP-1090967-A2 | Composition for film formation, method of film formation, and insulating film | JSR Corporation (JP) | 2001-04-11 | — | — | EP | disclosed |
| EP-1088868-A2 | Composition for film formation, method of film formation, and insulating film | JSR Corporation (JP) | 2001-04-04 | — | — | EP | disclosed |