SCHEMBL3099044

SCHEMBL3099044

C=COC(COc1ccccc1)C1CCC(=C=O)CC1

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TEAD1 P28347 1/20 0.32
TEAD3 Q99594 1/20 0.32
LMNA P02545 1/20 0.32
SCN4A P35499 2/20 0.31
DRD2 P14416 3/20 0.31
DRD4 P21917 3/20 0.31
DRD3 P35462 3/20 0.31
THRB P10828 1/20 0.31
CASP1 P29466 1/20 0.31
MTNR1A P48039 2/20 0.30
MTNR1B P49286 2/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3089313 0.81 LMNA (0.39) LMNASCN4A
SCHEMBL3099048 0.80 SLC6A2 (0.34)
SCHEMBL5145957 0.70 AOC3 (0.38) TEAD1TEAD3
SCHEMBL11795671 0.66 LMNA (0.47) LMNASCN4ATHRBMTNR1AMTNR1B
SCHEMBL23239453 0.64 LMNA (0.53) LMNASCN4ADRD2DRD3MTNR1A
SCHEMBL1042779 0.62 LMNA (0.37) LMNAMTNR1AMTNR1B
SCHEMBL2168288 0.62 LMNA (0.42) LMNASCN4ATHRBMTNR1AMTNR1B
SCHEMBL9859418 0.62 LMNA (0.46) LMNASCN4AMTNR1AMTNR1B
SCHEMBL1044607 0.61 LMNA (0.46) LMNADRD2DRD4DRD3MTNR1A
SCHEMBL10774207 0.61 PPARG (0.49) LMNASCN4ATHRBMTNR1AMTNR1B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7794916-B2 Positive photosensitive composition, polymer compound used for the positive photosensitive composition, production method of the polymer compound, and pattern forming method using the positive photosensitive composition FUJIFILM CORPORATION (JP) 2010-09-14 US disclosed
EP-1465010-B1 Positive resist composition FUJIFILM CORP (JP) 2009-10-21 EP disclosed
US-20080187863-A1 POSITIVE PHOTOSENSITIVE COMPOSITION, POLYMER COMPOUND USED FOR THE POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD OF THE POLYMER COMPOUND, AND PATTERN FORMING METHOD USING THE POSITIVE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2008-08-07 US disclosed
EP-1925979-A1 Positive photosensitive composition, polymer compound used for the positive photosensitive composition, production method of the polymer compound, and pattern forming method using the positive photosensitive composition FUJIFILM Corporation (JP) 2008-05-28 EP disclosed
US-7232640-B1 Positive resist composition FUJIFILM CORPORATION (JP) 2007-06-19 US disclosed
US-20070128547-A1 POSITIVE RESIST COMPOSITION FUJI PHOTO FILM CO., LTD. 2007-06-07 US disclosed
EP-1465010-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2004-10-06 EP disclosed