SCHEMBL31029517

SCHEMBL31029517

OP(O)Oc1cccc(OP(O)O)c1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KMT2A Q03164 3/20 0.41
▸ MEN1 O00255 2/20 0.41
▸ ALDH1A1 P00352 2/20 0.36
▸ SMN1; SMN2 Q16637 2/20 0.36
▸ MITF O75030 1/20 0.36
▸ GAA P10253 1/20 0.36
▸ MAPT P10636 1/20 0.36
▸ GFER P55789 1/20 0.36
▸ NLRP1 Q9C000 1/20 0.36
▸ NOD2 Q9HC29 1/20 0.36
▸ CA1 P00915 1/20 0.36
▸ CA2 P00918 1/20 0.36
▸ CA9 Q16790 1/20 0.36
▸ FURIN P09958 2/20 0.34
▸ F2 P00734 1/20 0.34
▸ F10 P00742 1/20 0.34
▸ LMNA P02545 3/20 0.33
▸ TDP1 Q9NUW8 1/20 0.33
▸ CES2 O00748 1/20 0.32
▸ CES1 P23141 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28425351 0.85 CYP3A4 (0.48) ALDH1A1CA1CA2CA9LMNA
SCHEMBL13379205 0.84 ALDH1A1 (0.54) KMT2AMEN1ALDH1A1SMN1; SMN2MITF
SCHEMBL3748971 0.84 ACHE (0.56) KMT2AALDH1A1GAAF2LMNA
SCHEMBL6244035 0.84 KMT2A (0.46) KMT2AALDH1A1GAAMAPTLMNA
SCHEMBL30882003 0.84 ACHE (0.56) KMT2AALDH1A1GAAF2LMNA
SCHEMBL27857334 0.84 SLC6A2 (0.42) KMT2AMEN1CES2CES1HIF1A
SCHEMBL20702317 0.82 ALOX5 (0.43) —
SCHEMBL30275406 0.80 LTA4H (0.45) ALDH1A1SMN1; SMN2CA1CA2LMNA
SCHEMBL126344 0.80 LTA4H (0.45) ALDH1A1SMN1; SMN2CA1CA2LMNA
SCHEMBL31604177 0.79 KDM4E (0.45) KMT2AMEN1ALDH1A1SMN1; SMN2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12054611-B2 Poly(phenylene ether), curable composition containing poly(phenylene ether), dry film, prepreg, cured object, laminate, and electronic component TAIYO HOLDINGS CO., LTD. (JP) 2024-08-06 — — US disclosed
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