SCHEMBL31157799

SCHEMBL31157799

COc1ccc2cccc(O)c2n1.COc1ccc2cccc(O)c2n1.[Cu+2]

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
METAP2 P50579 1/20 0.56
PLAU P00749 1/20 0.52
NCF1 P14598 1/20 0.52
ALDH1A1 P00352 1/20 0.50
CYP1A2 P05177 1/20 0.50
CYP3A4 P08684 1/20 0.50
CYP2C9 P11712 1/20 0.50
HPGD P15428 1/20 0.50
ALOX12 P18054 1/20 0.50
CYP2C19 P33261 1/20 0.50
HIF1A Q16665 1/20 0.50
HSD17B10 Q99714 1/20 0.50
KMT2A Q03164 6/20 0.49
MEN1 O00255 5/20 0.49
NPC1 O15118 5/20 0.49
RAB9A P51151 4/20 0.49
MTNR1A P48039 6/20 0.48
MTNR1B P49286 6/20 0.48
AGTR1 P30556 3/20 0.48
ECE2 P0DPD6 2/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1043719 0.98 METAP2 (0.58) METAP2PLAUNCF1ALDH1A1CYP1A2
SCHEMBL30457998 0.96 METAP2 (0.56) METAP2PLAUNCF1ALDH1A1CYP1A2
SCHEMBL29040599 0.96 METAP2 (0.56) METAP2PLAUNCF1ALDH1A1CYP1A2
SCHEMBL29040602 0.96 METAP2 (0.56) METAP2PLAUNCF1ALDH1A1CYP1A2
SCHEMBL14337430 0.86 MTNR1A (0.46) METAP2PLAUNCF1ALDH1A1CYP1A2
SCHEMBL3227590 0.82 METAP2 (0.57) METAP2PLAUNCF1ALDH1A1CYP1A2
SCHEMBL4625590 0.80 MEN1 (0.56) METAP2PLAUNCF1ALDH1A1CYP3A4
SCHEMBL4626576 0.80 MEN1 (0.56) METAP2ALDH1A1CYP3A4HPGDALOX12
SCHEMBL7116996 0.79 METAP2 (0.53) METAP2PLAUNCF1ALDH1A1CYP1A2
SCHEMBL17931875 0.79 METAP2 (0.53) METAP2PLAUNCF1ALDH1A1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118829691-A Heat conductive addition-curable silicone composition and silicone cured product thereof 信越化学工业株式会社 2024-10-22 CN disclosed
CN-118804952-A Two-component heat-conductive addition-curable silicone composition and silicone cured product thereof 信越化学工业株式会社 2024-10-18 CN disclosed