SCHEMBL31325837

SCHEMBL31325837

CC[N+](C)(Cc1ccc(C)cc1)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
KDM4E B2RXH2 1/20 0.41
LMNA P02545 2/20 0.38
POLB P06746 2/20 0.38
DNM1 Q05193 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
MEN1 O00255 4/20 0.36
KMT2A Q03164 4/20 0.36
ACHE P22303 2/20 0.36
TSHR P16473 1/20 0.36
ALOX12 P18054 1/20 0.36
APOBEC3A P31941 1/20 0.35
APOBEC3G Q9HC16 1/20 0.35
HTT P42858 3/20 0.35
CYP2C19 P33261 1/20 0.35
TP53 P04637 1/20 0.35
MAPK1 P28482 1/20 0.35
IDO1 P14902 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31325829 0.84 ACHE (0.41) ALDH1A1TDP1KDM4ELMNASMN1; SMN2
SCHEMBL31325838 0.84 MAOB (0.44) ALDH1A1TDP1KDM4EDNM1SMN1; SMN2
SCHEMBL31325830 0.81 LTA4H (0.50) TDP1HTTTP53IDO1L3MBTL1
SCHEMBL5426524 0.80 ALDH1A1 (0.61) ALDH1A1TDP1KDM4EDNM1SMN1; SMN2
SCHEMBL31325832 0.79 LMNA (0.39) ALDH1A1TDP1KDM4ELMNAPOLB
SCHEMBL9342324 0.79 LMNA (0.48) ALDH1A1KDM4ELMNAPOLBSMN1; SMN2
SCHEMBL565173 0.79 ALDH1A1 (0.45) ALDH1A1TDP1KDM4ELMNAPOLB
Hydrochloric Acid SCHEMBL11785550 0.78 ALDH1A1 (0.65) ALDH1A1TDP1KDM4EDNM1SMN1; SMN2
SCHEMBL5436496 0.77 APOBEC3A (0.50) ALDH1A1TDP1KDM4ELMNADNM1
Hydrochloric Acid SCHEMBL8768477 0.77 ALDH1A1 (0.48) ALDH1A1TDP1KDM4ELMNAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025018368-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE 株式会社レゾナック 2025-01-23 WO disclosed