Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | CAMK2A | Q9UQM7 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.37 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.35 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.35 |
| ▸ | FFAR4 | Q5NUL3 | 1/20 | 0.35 |
| ▸ | CA12 | O43570 | 1/20 | 0.35 |
| ▸ | CA1 | P00915 | 1/20 | 0.35 |
| ▸ | CA2 | P00918 | 1/20 | 0.35 |
| ▸ | CA9 | Q16790 | 1/20 | 0.35 |
| ▸ | CNR1 | P21554 | 2/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | CNR2 | P34972 | 1/20 | 0.33 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.33 |
| ▸ | NTRK2 | Q16620 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21802606 | 0.92 | GPR84 (0.44) | LMNACAMK2AALDH1A1HPGDPOLB | |
| SCHEMBL132324 | 0.92 | LMNA (0.46) | LMNACAMK2AALDH1A1HPGDPOLB | |
| SCHEMBL29407499 | 0.92 | LMNA (0.52) | LMNACAMK2AALDH1A1HPGDPOLB | |
| SCHEMBL8454374 | 0.90 | GPR84 (0.48) | LMNACAMK2AALDH1A1HPGDPOLB | |
| SCHEMBL5355206 | 0.90 | LMNA (0.44) | LMNAALDH1A1HPGDPOLBGPR84 | |
| SCHEMBL21217233 | 0.90 | LMNA (0.44) | LMNAALDH1A1HPGDPOLBGPR84 | |
| SCHEMBL1202392 | 0.90 | LMNA (0.44) | LMNAALDH1A1HPGDPOLBGPR84 | |
| SCHEMBL4648086 | 0.90 | LMNA (0.44) | LMNAALDH1A1HPGDPOLBGPR84 | |
| SCHEMBL1232870 | 0.86 | ALDH1A1 (0.41) | LMNACAMK2AALDH1A1HPGDPOLB | |
| SCHEMBL17291895 | 0.84 | LMNA (0.44) | LMNACAMK2AALDH1A1HPGDGPR84 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7687448-B2 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-03-30 | — | — | US | claimed |
| US-20100009885-A1 | COMPOSITION FOR REMOVING A PHOTORESIST, METHOD OF PREPARING THE COMPOSITION, METHOD OF REMOVING A PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-01-14 | — | — | US | claimed |
| US-7608540-B2 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2009-10-27 | — | — | US | claimed |
| US-20060287207-A1 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-12-21 | — | — | US | claimed |
| US-5753708-A | Derivatives of 4-hydroxybutyric acid | KOEHLER GERNOT (DE) | 1998-05-19 | — | — | US | claimed |
| EP-0536369-A1 | 4-HYDROXY BUTYRIC ACID DERIVATIVES. | KOEHLER CHEMIE DR FRANZ (DE) | 1993-04-14 | — | — | EP | claimed |
| WO-1992019581-A1 | 4-HYDROXY BUTYRIC ACID DERIVATIVES | Dr. Franz Köhler Chemie GmbH (DE) | 1992-11-12 | — | — | WO | claimed |
| US-4143159-A | SKIN-CARE AGENTS CONTAINING HYDROXYALKYL CARBOXAMIDES AND PROCESS | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) | 1979-03-06 | — | — | US | claimed |
| US-7687448-B2 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-03-30 | — | — | US | disclosed |
| US-7687448-B2 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-03-30 | — | — | US | disclosed |
| US-7687448-B2 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-03-30 | — | — | US | disclosed |
| US-20100009885-A1 | COMPOSITION FOR REMOVING A PHOTORESIST, METHOD OF PREPARING THE COMPOSITION, METHOD OF REMOVING A PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-01-14 | — | — | US | disclosed |
| US-20100009885-A1 | COMPOSITION FOR REMOVING A PHOTORESIST, METHOD OF PREPARING THE COMPOSITION, METHOD OF REMOVING A PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-01-14 | — | — | US | disclosed |
| US-20100009885-A1 | COMPOSITION FOR REMOVING A PHOTORESIST, METHOD OF PREPARING THE COMPOSITION, METHOD OF REMOVING A PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-01-14 | — | — | US | disclosed |
| US-7608540-B2 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2009-10-27 | — | — | US | disclosed |
| US-7608540-B2 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2009-10-27 | — | — | US | disclosed |
| US-7608540-B2 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2009-10-27 | — | — | US | disclosed |
| US-20060287207-A1 | Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-12-21 | — | — | US | disclosed |