SCHEMBL3138984

SCHEMBL3138984

CN(Cc1ccccc1)[SiH](C)C

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.58
ALDH1A1 P00352 3/20 0.58
AOC3 Q16853 2/20 0.54
TAAR1 Q96RJ0 2/20 0.48
CARM1 Q86X55 1/20 0.47
PRMT6 Q96LA8 1/20 0.47
PRMT8 Q9NR22 1/20 0.47
NPC1 O15118 2/20 0.45
RAB9A P51151 2/20 0.45
LMNA P02545 2/20 0.45
CA12 O43570 2/20 0.45
CA9 Q16790 2/20 0.45
ADRA2B P18089 1/20 0.45
ADRA2C P18825 1/20 0.45
SLC6A2 P23975 1/20 0.45
HTR2A P28223 1/20 0.45
SLC6A4 P31645 1/20 0.45
ADRA1A P35348 1/20 0.45
OPRK1 P41145 1/20 0.45
SLC6A3 Q01959 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL27259195 0.98 TSHR (0.56) TSHRALDH1A1AOC3TAAR1CARM1
SCHEMBL10654410 0.78 TSHR (0.54) TSHRALDH1A1AOC3TAAR1CARM1
SCHEMBL29878726 0.77 TSHR (0.54) TSHRALDH1A1AOC3TAAR1CARM1
SCHEMBL19039537 0.77 TSHR (0.54) TSHRALDH1A1AOC3TAAR1CARM1
SCHEMBL27259240 0.77 TAAR1 (0.52) ALDH1A1AOC3TAAR1PYCR1SIGMAR1
SCHEMBL24735547 0.74 TSHR (1.00) TSHRALDH1A1AOC3TAAR1CARM1
SCHEMBL5014268 0.74 TSHR (1.00) TSHRALDH1A1AOC3TAAR1CARM1
Dibemethine SCHEMBL10542007 0.74 ALDH1A1 (0.70) TSHRALDH1A1AOC3CARM1PRMT6
SCHEMBL11218123 0.74 TSHR (0.70) TSHRALDH1A1AOC3TAAR1CARM1
Dibemethine SCHEMBL276863 0.74 ALDH1A1 (0.70) TSHRALDH1A1AOC3CARM1PRMT6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11862471-B2 Manufacturing method for semiconductor device KIOXIA CORPORATION (JP) 2024-01-02 US claimed
US-20220238345-A1 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE KIOXIA CORPORATION (JP) 2022-07-28 US claimed
US-6743737-B2 FORMING INTEGRATED CIRCUITS; PLASMA VAPOR DEPOSITION APPLIED MATERIALS, INC. 2004-06-01 US claimed
US-20030054667-A1 Method of improving moisture resistance of low dielectric constant films APPLIED MATERIALS, INC. 2003-03-20 US claimed
US-6448187-B2 DEPOSITING A SILICON OXIDE FILM BY OXIDATION OF SILICON COMPOUND, EXPOSING TO WATER OR A HYDROPHOBIC-IMPARTING SURFACTANT SUCH AS HEXAMETHYLDISILAZANE AND CURING APPLIED MATERIALS, INC. 2002-09-10 US claimed
US-6365643-B1 Photoinitiators for cationic curing TH. GOLDSCHMIDT AG (DE) 2002-04-02 US claimed
US-20010026849-A1 Method of improving moisture resistance of low dielectric constant films APPLIED MATERIALS, INC. 2001-10-04 US claimed
US-6245690-B1 EXPOSING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITED FILM OF OXIDIZED ORGANOSILICON COMPOUND TO A HYDROPHOBIC-IMPARTING SURFACTANT SUCH AS HEXAMETHYLDISILAZANE PRIOR TO THERMALLY CURING TO CONTROL CARBON CONTENT IN DEPOSITED FILM APPLIED MATERIALS, INC. 2001-06-12 US claimed
US-11862471-B2 Manufacturing method for semiconductor device KIOXIA CORPORATION (JP) 2024-01-02 US disclosed
US-20220406611-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE KIOXIA CORPORATION (JP) 2022-12-22 US disclosed
CN-115483101-A Method for manufacturing semiconductor device 铠侠股份有限公司 2022-12-16 CN disclosed
US-20220238345-A1 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE KIOXIA CORPORATION (JP) 2022-07-28 US disclosed
US-7825042-B2 Very low dielectric constant plasma-enhanced CVD films APPLIED MATERIALS, INC. (US) 2010-11-02 US disclosed
US-20100081291-A1 Very Low Dielectric Constant Plasma-Enhanced CVD Films APPLIED MATERIALS, INC. (US) 2010-04-01 US disclosed
US-20010026849-A1 Method of improving moisture resistance of low dielectric constant films APPLIED MATERIALS, INC. 2001-10-04 US disclosed
EP-1119035-A2 Method for depositing a low dielectric constant film Applied Materials, Inc. (US) 2001-07-25 EP disclosed
US-6245690-B1 EXPOSING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITED FILM OF OXIDIZED ORGANOSILICON COMPOUND TO A HYDROPHOBIC-IMPARTING SURFACTANT SUCH AS HEXAMETHYLDISILAZANE PRIOR TO THERMALLY CURING TO CONTROL CARBON CONTENT IN DEPOSITED FILM APPLIED MATERIALS, INC. 2001-06-12 US disclosed
EP-0112434-B1 HYDROGEN BEARING SILYL CARBAMATES UNION CARBIDE CORPORATION (US) 1988-08-17 EP disclosed
EP-0112434-A2 Hydrogen bearing silyl carbamates UNION CARBIDE CORPORATION (US) 1984-07-04 EP disclosed
US-4400526-A Hydrogen bearing silyl carbamates UNION CARBIDE CORPORATION (US) 1983-08-23 US disclosed