SCHEMBL3142115

SCHEMBL3142115

O=C(CCl)c1cccc(Cl)c1Cl

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ERCC5 P28715 2/20 0.62
FEN1 P39748 2/20 0.62
TSHR P16473 2/20 0.61
P2RX7 Q99572 4/20 0.51
ALDH1A1 P00352 3/20 0.50
MAPK1 P28482 2/20 0.50
HIF1A Q16665 2/20 0.50
TAS1R3 Q7RTX0 1/20 0.49
TAS1R1 Q7RTX1 1/20 0.49
TAS1R2 Q8TE23 1/20 0.49
MGAM O43451 1/20 0.48
AMY1A P0DUB6 1/20 0.48
GAA P10253 1/20 0.48
SI P14410 1/20 0.48
MGAM2 Q2M2H8 1/20 0.48
GSK3B P49841 3/20 0.47
CES2 O00748 1/20 0.45
CES1 P23141 1/20 0.45
JAK2 O60674 1/20 0.45
MEN1 O00255 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL976846 0.83 CES2 (0.60) ERCC5FEN1ALDH1A1MAPK1HIF1A
SCHEMBL29560924 0.83 CES2 (0.60) ERCC5FEN1ALDH1A1MAPK1HIF1A
SCHEMBL27653603 0.82 KLKB1 (0.49) ERCC5FEN1TSHRP2RX7ALDH1A1
SCHEMBL15189611 0.82 ERCC5 (0.61) ERCC5FEN1TSHRP2RX7ALDH1A1
SCHEMBL1199039 0.82 ERCC5 (0.61) ERCC5FEN1TSHRP2RX7ALDH1A1
SCHEMBL2255346 0.82 ERCC5 (0.61) ERCC5FEN1TSHRP2RX7ALDH1A1
SCHEMBL256945 0.82 ERCC5 (0.61) ERCC5FEN1TSHRP2RX7ALDH1A1
SCHEMBL30547190 0.82 ERCC5 (0.61) ERCC5FEN1TSHRP2RX7ALDH1A1
SCHEMBL21055978 0.82 TSHR (0.45) ERCC5FEN1TSHRALDH1A1MAPK1
SCHEMBL29393662 0.81 ERCC5 (0.55) ERCC5FEN1TSHRP2RX7ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed
WO-2005019200-A2 ARYL PIPERIDINE DERIVATIVES AS VLA-1 INTEGRIN ANTAGONISTS AND USES THEREOF ICOS CORPORATION (US) 2005-03-03 WO disclosed
WO-2005019200-A2 ARYL PIPERIDINE DERIVATIVES AS VLA-1 INTEGRIN ANTAGONISTS AND USES THEREOF ICOS CORPORATION (US) 2005-03-03 WO disclosed