SCHEMBL3142648

SCHEMBL3142648

CCCCC(CC)Cc1cc(C)ccc1S(=O)(=O)Nc1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(NS(=O)(=O)c3ccc(C)cc3CC(CC)CCCC)c2F)c1F

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.31
PLAU P00749 1/20 0.30
HPN P05981 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5200123 0.89 METAP2 (0.34) ALDH1A1
SCHEMBL2128578 0.88 MOGAT2 (0.33)
SCHEMBL3142662 0.86 TSHR (0.32) PLAUHPN
SCHEMBL23854487 0.77
SCHEMBL5200369 0.76
SCHEMBL482969 0.75 ALDH1A1 (0.33) ALDH1A1
SCHEMBL23854456 0.75 TSHR (0.33) ALDH1A1
SCHEMBL5199612 0.75
SCHEMBL482890 0.75 KEAP1 (0.42) ALDH1A1
SCHEMBL598450 0.74 CYP3A4 (0.36) ALDH1A1PLAUHPN

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2105795-B1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORP (JP) 2016-12-28 EP disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 US disclosed
EP-2095947-B1 Resin composition and relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORP (JP) 2013-11-27 EP disclosed
EP-2106906-B1 Relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORP (JP) 2013-08-14 EP disclosed
US-8278387-B2 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
US-8273520-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
US-20100075118-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2010-03-25 US disclosed
US-20100003618-A1 POLYMER HAVING POLYMERIZABLE GROUP, POLYMERIZABLE COMPOSITION, PLANOGRAPHIC PRINTING PLATE PRECURSOR, AND PLANOGRAPHIC PRINTING METHOD USING THE SAME KUNITA KAZUTO 2010-01-07 US disclosed
EP-2106906-A1 Relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM Corporation (JP) 2009-10-07 EP disclosed
US-20090246469-A1 RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
US-20090246653-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
EP-2105795-A1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM Corporation (JP) 2009-09-30 EP disclosed
US-20090220752-A1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2009-09-03 US disclosed
EP-2095947-A1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM Corporation (JP) 2009-09-02 EP disclosed
US-20090191481-A1 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed
US-20090191479-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2009-07-30 US disclosed