SCHEMBL31429664

SCHEMBL31429664

CCc1nc(-c2ccc(C)cc2O)[nH]c1C

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
F2 P00734 2/20 0.45
F10 P00742 2/20 0.45
PLG P00747 2/20 0.45
PLAU P00749 2/20 0.45
PRSS1 P07477 2/20 0.45
PLAT P00750 1/20 0.45
GRK6 P43250 1/20 0.42
GAA P10253 3/20 0.38
MGAM O43451 2/20 0.38
SI P14410 2/20 0.38
MGAM2 Q2M2H8 2/20 0.38
SMPD3 Q9NY59 2/20 0.37
TRPA1 O75762 1/20 0.37
NPC1 O15118 4/20 0.37
RAB9A P51151 4/20 0.37
MEN1 O00255 4/20 0.37
KMT2A Q03164 4/20 0.37
HPGD P15428 3/20 0.37
HSD17B10 Q99714 3/20 0.37
KDM4E B2RXH2 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31429719 0.89 F2 (0.46) F2F10PLGPLAUPRSS1
SCHEMBL31429578 0.85 SMPD3 (0.54) F2F10PLGPLAUPRSS1
SCHEMBL31429774 0.85 SLC9A1 (0.39) GAAMGAMSIMGAM2SMPD3
SCHEMBL31429665 0.85 GAA (0.37) F2F10PLGPLAUPRSS1
SCHEMBL31429645 0.85 AMY1A (0.46) F2F10PLGPLAUPRSS1
SCHEMBL31429523 0.83 KDM4E (0.51) GAAMGAMSIMGAM2NPC1
SCHEMBL31429557 0.80 F2 (0.49) F2F10PLGPLAUPRSS1
SCHEMBL31429765 0.76 SMPD3 (0.53) F2F10PLGPLAUPRSS1
SCHEMBL31429598 0.75 F2 (0.45) F2F10PLGPLAUPRSS1
SCHEMBL13203516 0.75 RAB9A (0.61) GAANPC1RAB9AKMT2AHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L F2 3877/4885F10 2016/4885PLG 3950/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.