SCHEMBL31429665

SCHEMBL31429665

CCc1nc(-c2ccc(Br)cc2O)[nH]c1C

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.37
NPC1 O15118 1/20 0.37
NFKB1 P19838 1/20 0.37
RAB9A P51151 1/20 0.37
NFKB2 Q00653 1/20 0.37
RELA Q04206 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
GFER P55789 1/20 0.36
PTGES O14684 2/20 0.36
MGAM O43451 2/20 0.36
SI P14410 2/20 0.36
MGAM2 Q2M2H8 2/20 0.36
SMPD3 Q9NY59 2/20 0.36
KDM4E B2RXH2 2/20 0.35
HPGD P15428 2/20 0.35
HSD17B10 Q99714 1/20 0.35
MAOA P21397 2/20 0.35
MAOB P27338 2/20 0.35
HTR2C P28335 2/20 0.35
HTR2B P41595 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31429574 0.86 SMPD3 (0.52) GAANPC1NFKB1RAB9ANFKB2
SCHEMBL31429664 0.85 F2 (0.45) GAANPC1NFKB1RAB9ANFKB2
SCHEMBL31429774 0.82 SLC9A1 (0.39) GAANPC1NFKB1RAB9ANFKB2
SCHEMBL31429645 0.82 AMY1A (0.46) GAAMGAMSIMGAM2SMPD3
SCHEMBL31429576 0.81 SMPD3 (0.43) GAANPC1NFKB1RAB9ANFKB2
SCHEMBL31429523 0.80 KDM4E (0.51) GAANPC1RAB9ASMN1; SMN2GFER
SCHEMBL31429719 0.78 F2 (0.46) GAAMGAMSIMGAM2SMPD3
SCHEMBL31429524 0.77 PTGES (0.36) GAARAB9ASMN1; SMN2PTGESMGAM
SCHEMBL31429699 0.73 SMN1; SMN2 (0.39) GAANPC1NFKB1RAB9ANFKB2
SCHEMBL11866970 0.71 SIRT1 (0.41) GAAKDM4EHSD17B10ALDH1A1F2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L GAA 4594/4885NPC1 4813/4885NFKB1 2022/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.