⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3150607 | 0.87 | EPHX1 (0.31) | — | |
| SCHEMBL28025402 | 0.78 | MAOA (0.37) | — | |
| SCHEMBL1770488 | 0.76 | CA12 (0.34) | — | |
| SCHEMBL28909956 | 0.76 | CA12 (0.30) | — | |
| SCHEMBL29091821 | 0.74 | CA12 (0.37) | — | |
| SCHEMBL728332 | 0.74 | MAOA (0.32) | — | |
| SCHEMBL1897574 | 0.72 | EPHX1 (0.34) | — | |
| SCHEMBL28982357 | 0.72 | ALOX15 (0.33) | — | |
| SCHEMBL28369762 | 0.71 | CA12 (0.31) | — | |
| SCHEMBL3158601 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12386259-B2 | Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-12 | — | — | US | disclosed |
| WO-2024225072-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND CURED FILM | 旭化成株式会社 | 2024-10-31 | — | — | WO | disclosed |
| WO-2024210063-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, CURED FILM, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2024-10-10 | — | — | WO | disclosed |
| US-20240329525-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-10-03 | — | — | US | disclosed |
| WO-2020026840-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | 旭化成株式会社 | 2020-02-06 | — | — | WO | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| US-20180373147-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-12-27 | — | — | US | disclosed |
| US-20170165879-A1 | RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-06-15 | — | — | US | disclosed |
| US-20170102613-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-04-13 | — | — | US | disclosed |
| US-9575410-B2 | Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-02-21 | — | — | US | disclosed |
| US-20140349222-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2014-11-27 | — | — | US | disclosed |
| US-7687208-B2 | Positive photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2010-03-30 | — | — | US | disclosed |
| US-20090202794-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-08-13 | — | — | US | disclosed |
| EP-2056163-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2009-05-06 | — | — | EP | disclosed |