P-Xylene

P-Xylene

SCHEMBL3152017

C=COCCOC=C.Cc1ccc(C)cc1

nearest known ligand 0.42

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACHE P22303 3/20 0.42
TDP1 Q9NUW8 1/20 0.42
LMNA P02545 2/20 0.38
HTT P42858 2/20 0.36
ALDH1A1 P00352 2/20 0.36
MAPT P10636 2/20 0.36
KDM4E B2RXH2 1/20 0.36
AGXT P21549 2/20 0.36
HPGD P15428 1/20 0.35
IDO1 P14902 1/20 0.35
CYP2A6 P11509 1/20 0.35
DRD2 P14416 1/20 0.34
DRD4 P21917 1/20 0.34
DRD3 P35462 1/20 0.34
TGM2 P21980 1/20 0.34
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.33
NPC1 O15118 1/20 0.33
RAB9A P51151 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL720020 0.87 DRD2 (0.48) HTTKDM4EHPGDDRD2DRD4
P-Xylene SCHEMBL14117993 0.86 LMNA (0.38) ACHETDP1LMNAHTTALDH1A1
SCHEMBL1618666 0.84 CYP1A2 (0.45) LMNAALDH1A1MAPTAGXTIDO1
SCHEMBL13925376 0.82 DRD2 (0.44) LMNAHTTALDH1A1KDM4EHPGD
M-Xylene SCHEMBL17601872 0.81 ACHE (0.52) ACHETDP1HTTALDH1A1MAPT
O-Xylene SCHEMBL17601869 0.80 TSHR (0.48) ACHETDP1LMNAHTTALDH1A1
SCHEMBL13567324 0.80 RAB9A (0.47) TDP1LMNAHTTALDH1A1MAPT
SCHEMBL1617797 0.80 CA12 (0.44) LMNAHTTALDH1A1HPGDCA1
SCHEMBL14427909 0.78 DRD2 (0.41) HTTALDH1A1MAPTHPGDDRD2
SCHEMBL12619843 0.78 DRD2 (0.41) HTTMAPTHPGDDRD2DRD4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12038557-B2 Anti-reflection film DAICEL CORPORATION (JP) 2024-07-16 US disclosed
WO-2024135086-A1 PHOTOCURABLE COMPOSITION, UNDERCOAT LAYER, LAMINATE AND DISPLAY DEVICE 株式会社ダイセル 2024-06-27 WO disclosed
US-20240210817-A1 RESIN MOLDED ARTICLE PRODUCTION METHOD AND OPTICAL COMPONENT PRODUCTION METHOD DAICEL CORPORATION (JP) 2024-06-27 US disclosed
WO-2024095928-A1 EPOXY COMPOUND PRODUCT 株式会社ダイセル 2024-05-10 WO disclosed
US-11927884-B2 Resin molded article production method and optical component production method DAICEL CORPORATION (JP) 2024-03-12 US disclosed
US-11915925-B2 Semiconductor device manufacturing method DAICEL CORPORATION (JP) 2024-02-27 US disclosed
US-11898057-B2 Weather-resistant hard coat composition for glass-substitute substrate, cured product, and laminate DAICEL CORPORATION (JP) 2024-02-13 US disclosed
US-11887975-B2 Semiconductor device manufacturing method DAICEL CORPORATION (JP) 2024-01-30 US disclosed
US-11866608-B2 Weather-resistant hard coat composition for metal, cured product, and coated metal substrate DAICEL CORPORATION (JP) 2024-01-09 US disclosed
EP-3603937-B1 RESIN MOLDED ARTICLE PRODUCTION METHOD AND OPTICAL COMPONENT PRODUCTION METHOD DAICEL CORP (JP) 2023-09-27 EP disclosed
US-20180142128-A1 CURABLE COMPOSITION, AND MOULDED BODY DAICEL CORPORATION (JP) 2018-05-24 US disclosed
EP-3312212-A1 CURABLE COMPOSITION Daicel Corporation (JP) 2018-04-25 EP disclosed
EP-3312211-A1 CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, PRODUCTION METHOD FOR ADHESIVE SHEET, AND DEVICE Daicel Corporation (JP) 2018-04-25 EP disclosed
US-20160297933-A1 POLYORGANOSILSESQUIOXANE, HARD COAT FILM, ADHESIVE SHEET, AND LAMINATE DAICEL CORPORATION (JP) 2016-10-13 US disclosed
US-20160130432-A1 COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL DAICEL CORPORATION (JP) 2016-05-12 US disclosed
US-20160083544-A1 COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL DAICEL CORPORATION (JP) 2016-03-24 US disclosed
EP-1505090-B1 REACTIVE DILUENT COMPOSITION AND CURABLE RESIN COMPOSITION NIPPON CATALYTIC CHEM IND (JP) 2010-03-31 EP disclosed
EP-1505090-A1 REACTIVE DILUENT COMPOSITION AND CURABLE RESIN COMPOSITION Nippon Shokubai Co., Ltd. (JP) 2005-02-09 EP disclosed
US-6767980-B2 ACTIVATED ENERGY RAY-CURABLE INK COMPOSITION FOR INK-JET PRINTING; VINYL ETHER GROUP-CONTAINING (METH)ACRYLIC ESTER NIPPON SHOKUBAI CO., LTD. (JP) 2004-07-27 US disclosed
US-20030199655-A1 Reactive diluent and curable resin composition NIPPON SHOKUBAI CO., LTD. 2003-10-23 US disclosed