SCHEMBL31558359

SCHEMBL31558359

Oc1ccc2ccccc2c1-c1nc2ccccc2n1Cc1ccc2ccccc2c1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 7/20 0.50
▸ ALDH1A1 P00352 5/20 0.50
▸ MAPT P10636 4/20 0.50
▸ KMT2A Q03164 4/20 0.50
▸ LMNA P02545 3/20 0.50
▸ HPGD P15428 3/20 0.50
▸ HTT P42858 3/20 0.50
▸ MEN1 O00255 2/20 0.50
▸ ALOX15 P16050 1/20 0.50
▸ TSHR P16473 1/20 0.50
▸ NPY1R P25929 1/20 0.50
▸ MAPK1 P28482 1/20 0.50
▸ NPY2R P49146 1/20 0.50
▸ HSD17B10 Q99714 1/20 0.50
▸ BRD4 O60885 1/20 0.47
▸ KCNH2 Q12809 1/20 0.47
▸ GAA P10253 3/20 0.42
▸ TDP1 Q9NUW8 1/20 0.42
▸ TP53 P04637 1/20 0.41
▸ PDE6D O43924 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8045378 0.70 KMT2A (0.70) KDM4EALDH1A1MAPTKMT2ALMNA
SCHEMBL17656090 0.69 ALOX5 (0.40) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL31558360 0.69 KDM4E (0.73) KDM4EALDH1A1MAPTKMT2ALMNA
SCHEMBL29625751 0.69 KDM4E (0.55) KDM4EALDH1A1MAPTKMT2ALMNA
SCHEMBL24953240 0.69 KDM4E (0.55) KDM4EALDH1A1MAPTKMT2ALMNA
SCHEMBL31558362 0.67 ALDH1A1 (1.00) KDM4EALDH1A1MAPTKMT2ALMNA
SCHEMBL10018495 0.66 TP53 (0.61) KDM4EALDH1A1MAPTKMT2ALMNA
SCHEMBL28116277 0.65 NPC1 (0.60) KDM4EALDH1A1MAPTKMT2ALMNA
SCHEMBL8381351 0.65 PTPN22 (0.60) KDM4EALDH1A1MAPTKMT2AMEN1
Hydrochloric Acid SCHEMBL10748650 0.65 PTPN22 (0.67) KDM4EALDH1A1MAPTKMT2AHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025100081-A1 COMPOSITION, EPOXY RESIN COMPOSITION, FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-05-15 — — WO claimed
WO-2025100081-A1 COMPOSITION, EPOXY RESIN COMPOSITION, FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-05-15 — — WO disclosed
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