SCHEMBL3179232

SCHEMBL3179232

CC12CC3CC(C)(C1)CC(c1ccc(Br)cc1)(C3)C2

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.45
KMT2A Q03164 2/20 0.45
RAD52 P43351 1/20 0.45
EPHX2 P34913 4/20 0.43
TSHR P16473 1/20 0.41
GRIN1 Q05586 7/20 0.40
GRIN2A Q12879 7/20 0.40
GRIN2D O15399 6/20 0.40
GRIN3B O60391 6/20 0.40
GRIN2B Q13224 6/20 0.40
GRIN2C Q14957 6/20 0.40
GRIN3A Q8TCU5 6/20 0.40
LMNA P02545 3/20 0.38
SLC22A1 O15245 1/20 0.38
ESR1 P03372 1/20 0.38
ADRB3 P13945 1/20 0.38
ACHE P22303 1/20 0.38
OPRK1 P41145 1/20 0.38
MTOR P42345 1/20 0.38
HTT P42858 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4059726 0.84 MEN1 (0.37) MEN1KMT2ARAD52EPHX2TSHR
SCHEMBL22453128 0.82 LMNA (0.56) MEN1KMT2AEPHX2GRIN1GRIN2A
SCHEMBL5006770 0.82 EPHX2 (0.46) MEN1KMT2AEPHX2GRIN1GRIN2A
SCHEMBL8514237 0.82 GRIN1 (0.40) MEN1KMT2AEPHX2TSHRGRIN1
SCHEMBL28090104 0.81 GRIN1 (0.49) MEN1KMT2AEPHX2GRIN1GRIN2A
SCHEMBL21382098 0.80 MEN1 (0.51) MEN1KMT2ARAD52EPHX2GRIN1
SCHEMBL22453610 0.79 EPHX2 (0.50) EPHX2GRIN1GRIN2AGRIN2DGRIN3B
SCHEMBL29038978 0.79 PGR (0.55) EPHX2GRIN1GRIN2AGRIN2DGRIN3B
SCHEMBL17042512 0.79 ESR1 (0.45) MEN1KMT2AEPHX2GRIN1GRIN2A
SCHEMBL5000910 0.78 EPHX2 (0.40) MEN1KMT2AEPHX2GRIN1GRIN2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed