SCHEMBL3179550

SCHEMBL3179550

Fc1cccc(Oc2ccc(C3C4CC5CC(C4)CC3C5)cc2-c2cc(C3C4CC5CC(C4)CC3C5)ccc2Oc2cccc(F)c2)c1

nearest known ligand 0.42

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
SLC6A2 P23975 5/20 0.42
SLC6A4 P31645 5/20 0.42
SLC6A3 Q01959 4/20 0.42
HTR1A P08908 3/20 0.42
VEGFA P15692 2/20 0.37
KCNH2 Q12809 1/20 0.36
SCN3A Q9NY46 1/20 0.36
FFAR4 Q5NUL3 7/20 0.34
TNK2 Q07912 1/20 0.34
MAPT P10636 1/20 0.33
BRD4 O60885 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2711010 0.84 CHRNB2 (0.35) SLC6A2SLC6A4SLC6A3KCNH2
SCHEMBL2708643 0.81 SLC6A2 (0.37) SLC6A2SLC6A4SLC6A3HTR1AVEGFA
SCHEMBL2708497 0.77 SLC6A2 (0.43) SLC6A2SLC6A4SLC6A3HTR1AVEGFA
SCHEMBL2709273 0.75 MMP2 (0.36)
SCHEMBL2708638 0.75 MEN1 (0.41) SLC6A2SLC6A4SLC6A3HTR1AVEGFA
SCHEMBL2708804 0.73 POLB (0.39)
SCHEMBL2710730 0.73 HSD11B1 (0.41)
SCHEMBL2709037 0.70 KDM1A (0.33) KCNH2
SCHEMBL2708492 0.66 SLC6A2 (0.42) SLC6A2SLC6A4SLC6A3HTR1AVEGFA
SCHEMBL14299432 0.66 KDM1A (0.45) SLC6A2SLC6A4SLC6A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed