SCHEMBL3182720

SCHEMBL3182720

O=S(=O)(Cc1ccccc1)N(c1ccccc1)c1ccccc1

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSP90AA1 P07900 1/20 0.66
CA2 P00918 4/20 0.50
CA1 P00915 2/20 0.50
PRSS1 P07477 2/20 0.50
PRSS2 P07478 2/20 0.50
PRSS3 P35030 2/20 0.50
FAAH O00519 1/20 0.50
ELANE P08246 1/20 0.50
PRTN3 P24158 1/20 0.50
CA5A P35218 1/20 0.50
CA9 Q16790 1/20 0.50
CNR2 P34972 2/20 0.47
HPGD P15428 2/20 0.46
HSD17B10 Q99714 2/20 0.46
USP2 O75604 1/20 0.46
MMP1 P03956 1/20 0.45
MMP2 P08253 1/20 0.45
MMP9 P14780 1/20 0.45
MMP8 P22894 1/20 0.45
MMP13 P45452 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4431981 0.87 HSP90AA1 (0.51) HSP90AA1CA2CA1PRSS1PRSS2
SCHEMBL15672867 0.79 PKM (0.48) HSP90AA1CA2CA9HSD17B10KMT2A
SCHEMBL3822620 0.79 HSP90AA1 (0.61) HSP90AA1CA2CA1PRSS1PRSS2
SCHEMBL17865800 0.78 KDM4E (0.49) HSP90AA1HPGDHSD17B10KMT2ATSHR
SCHEMBL4204976 0.77 PKM (0.47) HSP90AA1CA2CA9HSD17B10KMT2A
SCHEMBL17333363 0.76 HSP90AA1 (0.58) HSP90AA1CA2CA1PRSS1PRSS2
SCHEMBL6503919 0.76 HSP90AA1 (0.57) HSP90AA1CA2CA1PRSS1PRSS2
SCHEMBL27843526 0.76 PRSS1 (0.58) HSP90AA1CA2CA1PRSS1PRSS2
SCHEMBL3174757 0.76 HSP90AA1 (0.57) HSP90AA1CA2CA1PRSS1PRSS2
SCHEMBL8840586 0.76 HSP90AA1 (0.57) HSP90AA1CA2CA1PRSS1PRSS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104271654-B polyamide composition with improved optical properties 巴斯夫欧洲公司 2016-10-19 CN disclosed
US-8614051-B2 Photosensitive resin composition and circuit formation substrate using the same HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-12-24 US disclosed
US-20130143011-A1 PHOTOSENSITIVE RESIN COMPOSITION HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2013-06-06 US disclosed
US-20120328856-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2012-12-27 US disclosed
US-8304160-B2 Photosensitive resin composition and circuit formation substrate using the same HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2012-11-06 US disclosed
US-20100260983-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-10-14 US disclosed
US-7642018-B2 Photosensitive resin composition, pattern forming method and electronic parts using the photosensitive resin composition HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2010-01-05 US disclosed
US-20070218400-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS USING THE PHOTOSENSITIVE RESIN COMPOSITION HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2007-09-20 US disclosed