SCHEMBL3189488

SCHEMBL3189488

CO[SiH](CCCCNCc1ccccc1)OC

nearest known ligand 0.61

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ MAOA P21397 1/20 0.61
▸ CHRM2 P08172 3/20 0.59
▸ SIGMAR1 Q99720 3/20 0.56
▸ MEN1 O00255 1/20 0.52
▸ KMT2A Q03164 1/20 0.52
▸ TDP1 Q9NUW8 1/20 0.52
▸ SCN8A Q9UQD0 1/20 0.49
▸ BCHE P06276 1/20 0.47
▸ HDAC3 O15379 2/20 0.46
▸ HDAC1 Q13547 2/20 0.46
▸ HDAC2 Q92769 2/20 0.46
▸ HDAC8 Q9BY41 2/20 0.46
▸ NCOR2 Q9Y618 2/20 0.46
▸ GAA P10253 1/20 0.46
▸ MAPT P10636 1/20 0.46
▸ DRD4 P21917 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15361046 0.98 MAOA (0.65) MAOACHRM2SIGMAR1MEN1KMT2A
SCHEMBL4131258 0.97 CHRM2 (0.61) MAOACHRM2SIGMAR1MEN1KMT2A
SCHEMBL15360360 0.95 MAOA (0.58) MAOACHRM2SIGMAR1MEN1KMT2A
SCHEMBL9066721 0.84 MAOA (0.58) MAOACHRM2SIGMAR1MEN1KMT2A
SCHEMBL4129114 0.84 SIGMAR1 (0.59) SIGMAR1MEN1KMT2AGAA
SCHEMBL15360866 0.83 MAOA (0.61) MAOACHRM2SIGMAR1MEN1KMT2A
SCHEMBL7769014 0.80 SIGMAR1 (0.41) MAOACHRM2SIGMAR1MEN1KMT2A
Benzylamine SCHEMBL5682353 0.80 LOXL2 (0.40) MAOACHRM2SIGMAR1SCN8A
SCHEMBL4932707 0.80 MAOA (0.95) MAOACHRM2SIGMAR1MEN1KMT2A
SCHEMBL3921217 0.79 MAOA (0.55) MAOACHRM2SIGMAR1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3950724-B1 CONJUGATED DIENE COPOLYMER AND METHOD FOR MANUFACTURING CONJUGATED DIENE COPOLYMER ZEON CORP (JP) 2026-02-18 — — EP disclosed
US-12545691-B2 Tertiary hydroxyl functional alkoxysilanes and methods for preparing thereof HENKEL AG & CO. KGAA (DE) 2026-02-10 — — US disclosed
US-20250230301-A1 RUBBER COMPOSITION FOR HEAVY-DUTY TIRES ZEON CORPORATION (JP) 2025-07-17 — — US disclosed
US-20250197612-A1 RUBBER COMPOSITION FOR SIDEWALL ZS ELASTOMERS CO., LTD. (JP) 2025-06-19 — — US disclosed
US-20250179234-A1 RUBBER COMPOSITION FOR HEAVY-LOAD TIRE ZS ELASTOMERS CO., LTD. (JP) 2025-06-05 — — US disclosed
EP-3778654-B1 METHOD FOR PRODUCING CONJUGATED DIENE RUBBER ZEON CORP (JP) 2025-02-26 — — EP disclosed
EP-4502035-A1 RUBBER COMPOSITION FOR HEAVY-DUTY TIRES ZS Elastomers Co., Ltd. (JP) 2025-02-05 — — EP disclosed
EP-4484487-A1 RUBBER COMPOSITION FOR HEAVY-LOAD TIRE ZS Elastomers Co., Ltd. (JP) 2025-01-01 — — EP disclosed
EP-4484488-A1 RUBBER COMPOSITION FOR SIDEWALL ZS Elastomers Co., Ltd. (JP) 2025-01-01 — — EP disclosed
US-12139572-B2 Conjugated diene copolymer and method for manufacturing conjugated diene copolymer ZS ELASTOMERS CO., LTD. (JP) 2024-11-12 — — US disclosed
US-20060214153-A1 Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more HITACHI CHEMICAL CO., LTD. (JP) 2006-09-28 — — US disclosed
US-20060014873-A1 Encapsulating epoxy resin composition, and electronic parts device using the same HITACHI CHEMICAL CO., LTD. (JP) 2006-01-19 — — US disclosed
US-20050267286-A1 Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative HITACHI CHEMICAL CO., LTD. (JP) 2005-12-01 — — US disclosed
US-20050222300-A1 Encapsulating epoxy resin composition, and electronic parts device using the same HITACHI CHEMICAL CO., LTD. (JP) 2005-10-06 — — US disclosed
US-20050165202-A1 Curing accelerator for curing resin, curing resin composition and electronic component device HITACHI CHEMICAL CO., LTD. (JP) 2005-07-28 — — US disclosed
WO-2003072628-A1 ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME HITACHI CHEMICAL CO., LTD. (JP) 2003-09-04 — — WO disclosed
WO-2003072655-A1 ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME HITACHI CHEMICAL CO., LTD. (JP) 2003-09-04 — — WO disclosed
EP-0423334-B1 RESIN COMPOSITION AND PROCESS FOR FORMING TRANSPARENT THIN FILM NIPPON KAYAKU KK (JP) 1996-09-18 — — EP disclosed
US-5180794-A Resin compositions and process for forming transparent thin films NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1993-01-19 — — US disclosed
EP-0423334-A1 RESIN COMPOSITION AND PROCESS FOR FORMING TRANSPARENT THIN FILM NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1991-04-24 — — EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12545691-B2 Tertiary hydroxyl functional alkoxysilanes and methods for preparing thereof HCCS, EGLN1, RRS1 MAOA 2132/4885CHRM2 1667/4885SIGMAR1 436/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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