SCHEMBL3190403

SCHEMBL3190403

CCc1cc(CC)c([S+](c2ccccc2)c2ccccc2)c(CC)c1.O=S(=O)([O-])c1c(F)cccc1F

nearest known ligand 0.33

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
KAT6A Q92794 1/20 0.33
KEAP1 Q14145 1/20 0.32
PKM P14618 1/20 0.32
LMNA P02545 1/20 0.30
KMT2A Q03164 1/20 0.30
PSIP1 O75475 1/20 0.30
PTGS1 P23219 1/20 0.30
PTGS2 P35354 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3188835 0.89 PTGS2 (0.33) KAT6APTGS1PTGS2
SCHEMBL3182835 0.87 KAT6A (0.34) KAT6AKEAP1PKM
SCHEMBL3193625 0.85 KMT2A (0.39) PKMKMT2APTGS2
SCHEMBL3200703 0.83 PTGS1 (0.31) PTGS1PTGS2
SCHEMBL3194684 0.82 HTR2A (0.38) PKMKMT2A
SCHEMBL3189010 0.81 TP53 (0.43) LMNAPTGS1PTGS2
SCHEMBL3197933 0.80 POLQ (0.34)
SCHEMBL3201835 0.79 CYP19A1 (0.38) KEAP1LMNA
SCHEMBL3194861 0.79 PKM (0.36) KAT6AKEAP1PKMLMNAKMT2A
SCHEMBL3181557 0.78 PKM (0.34) KAT6APKMLMNAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8206888-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2012-06-26 US disclosed
US-20100028800-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-02-04 US disclosed
EP-1953593-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2008-08-06 EP disclosed
US-7060414-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-06-13 US disclosed
US-20050158657-A1 Radiation-sensitive resin composition SUZUKI AKI (JP) 2005-07-21 US disclosed
US-6899989-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-05-31 US disclosed