Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 9/20 | 0.58 |
| ▸ | MAPT | P10636 | 7/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.47 |
| ▸ | PPARG | P37231 | 1/20 | 0.47 |
| ▸ | NPC1 | O15118 | 3/20 | 0.43 |
| ▸ | RAB9A | P51151 | 3/20 | 0.43 |
| ▸ | APP | P05067 | 1/20 | 0.43 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.41 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.40 |
| ▸ | PDE4B | Q07343 | 1/20 | 0.40 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.40 |
| ▸ | THRB | P10828 | 1/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.40 |
| ▸ | RECQL | P46063 | 1/20 | 0.40 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.40 |
| ▸ | MEN1 | O00255 | 1/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.40 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5685426 | 0.89 | MAPT (0.42) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL3185135 | 0.87 | GAA (0.66) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL3260844 | 0.86 | GAA (0.56) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL3188632 | 0.85 | GAA (0.59) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL5684774 | 0.84 | MAPT (0.52) | GAAMAPTALDH1A1PTPN1L3MBTL1 | |
| SCHEMBL16147721 | 0.83 | MAPT (0.47) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL134305 | 0.82 | ALDH1A1 (0.53) | MAPTALDH1A1NPC1RAB9AL3MBTL1 | |
| Hydrochloric Acid SCHEMBL29522911 | 0.81 | ALDH1A1 (0.52) | MAPTALDH1A1NPC1RAB9AL3MBTL1 | |
| SCHEMBL9703612 | 0.79 | MAPT (0.52) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL28197378 | 0.78 | MAPT (0.48) | GAAMAPTALDH1A1PPARGNPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7544727-B2 | molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-09 | — | — | US | claimed |
| CN-109071780-B | Epoxy resin composition and electronic component device | 昭和电工材料株式会社 | 2022-04-08 | — | — | CN | disclosed |
| US-7846998-B2 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2010-12-07 | — | — | US | disclosed |
| US-7666953-B2 | Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent | HITACHI CHEMICAL CO, LTD. (JP) | 2010-02-23 | — | — | US | disclosed |
| US-7544727-B2 | molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-09 | — | — | US | disclosed |
| US-20090143511-A1 | ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-04 | — | — | US | disclosed |
| US-20090137717-A1 | ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| US-20090062430-A1 | Epoxy Resin Composition for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20090005480-A1 | REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR | NAKAMURA SHINYA | 2009-01-01 | — | — | US | disclosed |
| US-20080262135-A1 | REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-10-23 | — | — | US | disclosed |
| US-7397139-B2 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2008-07-08 | — | — | US | disclosed |
| US-20080039556-A1 | Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| US-20060214153-A1 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2006-09-28 | — | — | US | disclosed |
| US-20060074150-A1 | molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; | HITACHI CHEMICAL CO., LTD. (JP) | 2006-04-06 | — | — | US | disclosed |
| US-20060014873-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20050267286-A1 | Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative | HITACHI CHEMICAL CO., LTD. (JP) | 2005-12-01 | — | — | US | disclosed |
| US-20050222300-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| US-20050165202-A1 | Curing accelerator for curing resin, curing resin composition and electronic component device | HITACHI CHEMICAL CO., LTD. (JP) | 2005-07-28 | — | — | US | disclosed |
| US-20030201548-A1 | Epoxy resin molding material for sealing | IKEZAWA RYOICHI (JP) | 2003-10-30 | — | — | US | disclosed |
| WO-2003072628-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20090005480-A1 | REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR | HDHD5, EHMT2, HRH2 | GAA 2482/4885MAPT 4473/4885ALDH1A1 839/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.