Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 7/20 | 0.56 |
| ▸ | MAPT | P10636 | 6/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.46 |
| ▸ | PPARG | P37231 | 1/20 | 0.46 |
| ▸ | NPC1 | O15118 | 3/20 | 0.43 |
| ▸ | RAB9A | P51151 | 3/20 | 0.43 |
| ▸ | APP | P05067 | 1/20 | 0.42 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.40 |
| ▸ | PDE4B | Q07343 | 1/20 | 0.39 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | THRB | P10828 | 1/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
| ▸ | RECQL | P46063 | 1/20 | 0.39 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3198023 | 0.86 | GAA (0.58) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL3200238 | 0.86 | GAA (0.61) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL3188632 | 0.84 | GAA (0.59) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL722358 | 0.83 | ALDH1A1 (0.52) | MAPTALDH1A1NPC1RAB9AL3MBTL1 | |
| SCHEMBL3185135 | 0.79 | GAA (0.66) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL15360415 | 0.78 | ALDH1A1 (0.50) | MAPTALDH1A1L3MBTL1NPSR1BCHE | |
| SCHEMBL3197407 | 0.77 | GAA (0.62) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL2097210 | 0.77 | GAA (0.73) | GAAMAPTALDH1A1PPARGNPC1 | |
| SCHEMBL27614767 | 0.76 | L3MBTL1 (0.67) | MAPTALDH1A1NPC1RAB9AL3MBTL1 | |
| SCHEMBL31687722 | 0.76 | ALDH1A1 (0.47) | MAPTALDH1A1NPC1RAB9AL3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7544727-B2 | molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-09 | — | — | US | claimed |
| CN-109071780-B | Epoxy resin composition and electronic component device | 昭和电工材料株式会社 | 2022-04-08 | — | — | CN | disclosed |
| CN-101429322-B | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO LTD | 2012-04-18 | — | — | CN | disclosed |
| CN-101429323-B | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO LTD | 2011-07-20 | — | — | CN | disclosed |
| CN-101429324-B | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO LTD | 2011-05-04 | — | — | CN | disclosed |
| US-7846998-B2 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2010-12-07 | — | — | US | disclosed |
| US-7666953-B2 | Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent | HITACHI CHEMICAL CO, LTD. (JP) | 2010-02-23 | — | — | US | disclosed |
| CN-100569850-C | Epoxy resin molding material for encapsulation and electronic component device | HITACHI CHEMICAL CO LTD (JP) | 2009-12-16 | — | — | CN | disclosed |
| CN-100519650-C | Epoxy resin composition for encapsulation and electronic component using the same | HITACHI CHEMICAL CO LTD (JP) | 2009-07-29 | — | — | CN | disclosed |
| US-7544727-B2 | molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-09 | — | — | US | disclosed |
| US-20080039556-A1 | Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| CN-1972998-A | Epoxy resin molding material for sealing and electronic device | HITACHI CHEMICAL CO LTD (JP) | 2007-05-30 | — | — | CN | disclosed |
| US-20060214153-A1 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2006-09-28 | — | — | US | disclosed |
| US-20060074150-A1 | molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; | HITACHI CHEMICAL CO., LTD. (JP) | 2006-04-06 | — | — | US | disclosed |
| US-20060014873-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20050267286-A1 | Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative | HITACHI CHEMICAL CO., LTD. (JP) | 2005-12-01 | — | — | US | disclosed |
| US-20050222300-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| US-20050165202-A1 | Curing accelerator for curing resin, curing resin composition and electronic component device | HITACHI CHEMICAL CO., LTD. (JP) | 2005-07-28 | — | — | US | disclosed |
| US-20030201548-A1 | Epoxy resin molding material for sealing | IKEZAWA RYOICHI (JP) | 2003-10-30 | — | — | US | disclosed |
| WO-2003072628-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |