Trifluoroacetic Acid

Trifluoroacetic Acid

SCHEMBL3199213

O=C([O-])C(F)(F)F.O=C([O-])C(F)(F)F.[Au+3].[OH-]

nearest known ligand 0.39

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ

The experimentally established mechanism targets of Trifluoroacetic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.36
CA2 P00918 1/20 0.35
CASP1 P29466 1/20 0.32
CA1 P00915 1/20 0.31
FAHD1 Q6P587 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Trifluoroacetic Acid SCHEMBL4358993 0.96 CA4 (0.38) CA4CA2CASP1CA1FAHD1
Trifluoroacetic Acid SCHEMBL3204069 0.90 CA1 (0.50) CA4CA2CA1
Trifluoroacetic Acid SCHEMBL5299214 0.89 CA4 (0.41) CA4CA2CASP1CA1FAHD1
Trifluoroacetic Acid SCHEMBL282294 0.88
Trifluoroacetic Acid SCHEMBL20571141 0.88 CA4 (0.38) CA4CA2CASP1CA1FAHD1
Trifluoroacetic Acid SCHEMBL20569310 0.88
Trifluoroacetic Acid SCHEMBL20541013 0.88 CA4 (0.38) CA4CA2CASP1CA1FAHD1
Trifluoroacetic Acid SCHEMBL20569660 0.88 CA4 (0.38) CA4CA2CASP1CA1FAHD1
Trifluoroacetic Acid SCHEMBL108536 0.88
Trifluoroacetic Acid SCHEMBL4342494 0.88 CA4 (0.38) CA4CA2CASP1CA1FAHD1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3568444-B1 INK CONTAINING A SECURITY ELEMENT THE ROYAL MINT LTD (GB) 2023-07-05 EP disclosed
US-20210277268-A1 INK CONTAINING A SECURITY ELEMENT THE ROYAL MINT LTD (GB) 2021-09-09 US disclosed
EP-3568444-A1 INK CONTAINING A SECURITY ELEMENT The Royal Mint Limited (GB) 2019-11-20 EP disclosed
WO-2018130827-A1 INK CONTAINING A SECURITY ELEMENT THE ROYAL MINT LIMITED (GB) 2018-07-19 WO disclosed
US-7732002-B2 Method for the fabrication of conductive electronic features CABOT CORPORATION (US) 2010-06-08 US disclosed
US-20100112195-A1 METHOD FOR THE FABRICATION OF CONDUCTIVE ELECTRONIC FEATURES CABOT CORPORATION 2010-05-06 US disclosed
US-7691664-B2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features CABOT CORPORATION (US) 2010-04-06 US disclosed
US-20100034986-A1 Low viscosity precursor compositions and methods for the deposition of conductive electronic features CABOT CORPORATION (US) 2010-02-11 US disclosed
US-7629017-B2 Methods for the deposition of conductive electronic features CABOT CORPORATION (US) 2009-12-08 US disclosed
US-7553512-B2 Method for fabricating an inorganic resistor CABOT CORPORATION (US) 2009-06-30 US disclosed
EP-1448725-A2 LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES Superior Micropowders LLC (US) 2004-08-25 EP disclosed
EP-1444055-A1 TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES Superior Micropowders LLC (US) 2004-08-11 EP disclosed
US-20030180451-A1 Low viscosity copper precursor compositions and methods for the deposition of conductive electronic features CABOT CORPORATION 2003-09-25 US disclosed
US-20030175411-A1 Precursor compositions and methods for the deposition of passive electrical components on a substrate CABOT CORPORATION 2003-09-18 US disclosed
US-20030161959-A1 Precursor compositions for the deposition of passive electronic features CABOT CORPORATION 2003-08-28 US disclosed
US-20030148024-A1 Low viscosity precursor compositons and methods for the depositon of conductive electronic features CABOT CORPORATION 2003-08-07 US disclosed
US-20030124259-A1 Metal precursor compound; and agent that reduces the conversion temperature of said precursor by at least 25 degrees C.; viscosity of at least 1000 centipoise CABOT CORPORATION 2003-07-03 US disclosed
US-20030108664-A1 Depositing silver metal precursor into portion of recessed feature, heating to temperature of not greater than 400 degrees C to convert precursor to conductor having resistivity of not greater than 10 times resistivity of metal CABOT CORPORATION 2003-06-12 US disclosed
WO-2003035279-A1 TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES SUPERIOR MICROPOWDERS LLC (US) 2003-05-01 WO disclosed
WO-2003032084-A2 LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES SUPERIOR MICROPOWDERS LLC (US) 2003-04-17 WO disclosed