SCHEMBL3225154

SCHEMBL3225154

N#COc1ccc(C(c2ccc(OC#N)cc2)c2ccc(OC#N)cc2)cc1

nearest known ligand 0.38

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
▸ SLC2A1 P11166 1/20 0.38
▸ CYP19A1 P11511 2/20 0.36
▸ ALDH1A1 P00352 4/20 0.33
▸ GAA P10253 1/20 0.33
▸ PBRM1 Q86U86 1/20 0.31
▸ ESR1 P03372 1/20 0.30
▸ ESR2 Q92731 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28065749 0.91 PBRM1 (0.41) SLC2A1CYP19A1ALDH1A1PBRM1
SCHEMBL15224618 0.91 PBRM1 (0.41) SLC2A1CYP19A1ALDH1A1PBRM1
SCHEMBL17042226 0.86 NAAA (0.39) CYP19A1ALDH1A1GAAPBRM1
SCHEMBL17042294 0.85 PBRM1 (0.38) ALDH1A1GAAPBRM1ESR1ESR2
SCHEMBL24787 0.84 CA1 (0.32) ALDH1A1
SCHEMBL12909396 0.82 CYP3A4 (0.39) —
SCHEMBL29913553 0.81 ESR1 (0.39) ALDH1A1GAAPBRM1ESR1ESR2
SCHEMBL139926 0.81 ESR1 (0.41) ALDH1A1GAAPBRM1ESR1ESR2
SCHEMBL27657818 0.81 MEN1 (0.38) ALDH1A1GAA
SCHEMBL21027532 0.81 ALDH1A1 (0.32) ALDH1A1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 190 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3438146-B1 CYANIC ACID ESTER COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, CURED ARTICLE, PREPREG, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE AGENT, METAL FOIL-CLAD LAMINATE PLATE, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2026-04-08 — — EP disclosed
US-12534617-B2 Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-01-27 — — US disclosed
US-12486371-B2 Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2025-12-02 — — US disclosed
EP-3805293-B1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2025-09-17 — — EP disclosed
EP-4610287-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-09-03 — — EP disclosed
EP-4610285-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-09-03 — — EP disclosed
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-27 — — US disclosed
CN-119866352-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 日本化药株式会社 2025-04-22 — — CN disclosed
CN-115003716-B Resin composition, resin sheet, prepreg, and printed wiring board 三菱瓦斯化学株式会社 2025-04-11 — — CN disclosed
US-20250109222-A1 CYCLIC ORGANOSILOXANE CONTAINING IMIDE BOND AND POLYMERIZABLE UNSATURATED BOND, AND CURABLE RESIN COMPOSITION COMPRISING SAID CYCLIC ORGANOSILOXANE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-04-03 — — US disclosed
US-6962744-B2 Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-11-08 — — US disclosed
US-20050186430-A1 Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof AMAGAI AKIKAZU (JP) 2005-08-25 — — US disclosed
US-20050065241-A1 Polyphenylene ether oligomer compound, derivatives thereof and use thereof ISHII KENJI (JP) 2005-03-24 — — US disclosed
US-20040214004-A1 Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof AMAGAI AKIKAZU (JP) 2004-10-28 — — US disclosed
US-6794481-B2 THERMOSETTING RESIN OR A PHOTOCURABLE RESIN AND ITS INTERMEDIATE PRODUCT EACH OF WHICH IS SUITABLE FOR USE IN ELECTRONICS FIELDS REQUIRING LOW DIELECTRIC CONSTANT, LOW DIELECTRIC LOSS TANGENT AND HIGH TOUGHNESS MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2004-09-21 — — US disclosed
US-20030130438-A1 Bifunctional phenylene ether oligomer, its derivatives its use and process for the production thereof MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2003-07-10 — — US disclosed
US-4754001-A POLYESTERS, HIGH PERFORMANCE BAYER AKTIENGESELLSCHAFT (DE) 1988-06-28 — — US disclosed
EP-0162241-B1 HEAT-CURABLE CYANATE RESIN AND ITS USE IN PREPARING COMPOSITES AND IPN'S BAYER AG (DE) 1987-09-30 — — EP disclosed
US-4631319-A WITH A POLYESTER, INTERPENETRATING POLYMER NETWORKS BAYER AKTIENGESELLSCHAFT (DE) 1986-12-23 — — US disclosed
EP-0162241-A1 Heat-curable cyanate resin and its use in preparing composites and IPN's BAYER AG (DE) 1985-11-27 — — EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20250109222-A1 CYCLIC ORGANOSILOXANE CONTAINING IMIDE BOND AND POLYMERIZABLE UNSATURATED BOND, AND CURABLE RESIN COMPOSITION COMPRISING SAID CYCLIC ORGANOSILOXANE ZYX, MUS81, H1-0 SLC2A1 4131/4885CYP19A1 4023/4885ALDH1A1 3113/4885
US-12534617-B2 Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board CHRM1, MRPL37, MRPL38 SLC2A1 4400/4885CYP19A1 3593/4885ALDH1A1 3075/4885
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device ASH2L, RER1, SEM1 SLC2A1 4477/4885CYP19A1 2353/4885ALDH1A1 659/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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