Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HPGD | P15428 | 3/20 | 0.37 |
| ▸ | HTT | P42858 | 2/20 | 0.37 |
| ▸ | CA12 | O43570 | 1/20 | 0.36 |
| ▸ | CA1 | P00915 | 1/20 | 0.36 |
| ▸ | CA2 | P00918 | 1/20 | 0.36 |
| ▸ | CA9 | Q16790 | 1/20 | 0.36 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.35 |
| ▸ | MAPT | P10636 | 3/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 4/20 | 0.35 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.35 |
| ▸ | MAOA | P21397 | 1/20 | 0.35 |
| ▸ | MASP2 | O00187 | 1/20 | 0.34 |
| ▸ | PLAU | P00749 | 1/20 | 0.34 |
| ▸ | THPO | P40225 | 1/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.34 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.34 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL305620 | 0.74 | LMNA (0.46) | HPGDHTTCA12CA1CA2 | |
| SCHEMBL10338374 | 0.72 | ELANE (0.35) | HPGDHTTALDH1A1MAPTGAA | |
| SCHEMBL5333327 | 0.72 | ALDH1A1 (0.37) | HPGDALDH1A1MAPTGAACYP3A4 | |
| SCHEMBL28716719 | 0.71 | NPSR1 (0.38) | ALDH1A1IMPDH2 | |
| Hydrochloric Acid SCHEMBL10885436 | 0.70 | ALDH1A1 (0.36) | HPGDALDH1A1MAPTGAACYP3A4 | |
| SCHEMBL9097535 | 0.69 | CA12 (0.59) | HPGDHTTCA12CA1CA2 | |
| SCHEMBL62657 | 0.69 | CA12 (0.59) | HPGDHTTCA12CA1CA2 | |
| SCHEMBL204877 | 0.69 | CA12 (0.59) | HPGDHTTCA12CA1CA2 | |
| SCHEMBL3630757 | 0.67 | TSHR (0.42) | HPGDALDH1A1MAPTLMNACYP1A2 | |
| Hydrochloric Acid SCHEMBL8640288 | 0.66 | CA12 (0.57) | HPGDHTTCA12CA1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 176 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116830037-A | Photosensitive element, method for producing cured product pattern, and method for producing circuit board | 株式会社力森诺科 | 2023-09-29 | — | — | CN | claimed |
| CN-106233205-B | Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package | 日立化成株式会社 | 2020-06-23 | — | — | CN | claimed |
| US-20040063025-A1 | Resist pattern, process for producing same, and utilization thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2004-04-01 | — | — | US | claimed |
| JP-10110008-A | — | — | None | — | — | JP | disclosed |
| JP-11102067-A | — | — | None | — | — | JP | disclosed |
| JP-6177510-A | — | — | None | — | — | JP | disclosed |
| JP-6069631-A | — | — | None | — | — | JP | disclosed |
| EP-4398289-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING LIQUID | FUJIFILM Corporation (JP) | 2024-07-10 | — | — | EP | disclosed |
| CN-118311828-A | Electroplating-resistant composition and dry film thereof | 太阳油墨（苏州）有限公司 | 2024-07-09 | — | — | CN | disclosed |
| CN-118259541-A | Electroplating-resistant composition and dry film thereof | 太阳油墨（苏州）有限公司 | 2024-06-28 | — | — | CN | disclosed |
| CN-118259542-A | Electroplating-resistant composition and dry film thereof | 太阳油墨（苏州）有限公司 | 2024-06-28 | — | — | CN | disclosed |
| US-20040086801-A1 | Method for manufacturing printeed wiring board and photosensitive resin composition used to be used for it | HITACHI CHEMICAL CO., LTD (JP) | 2004-05-06 | — | — | US | disclosed |
| US-20040063025-A1 | Resist pattern, process for producing same, and utilization thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2004-04-01 | — | — | US | disclosed |
| US-20040018446-A1 | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2004-01-29 | — | — | US | disclosed |
| US-20030186166-A1 | Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board | HITACHI CHEMICAL CO., LTD. (JP) | 2003-10-02 | — | — | US | disclosed |
| JP-2003215799-A | PHOTOSENSITIVE RESIN COMPOSITION | HITACHI CHEM CO LTD | 2003-07-30 | — | — | JP | disclosed |
| JP-H11102067-A | PHOTORESIST FILM | NIPPON SYNTHETIC CHEM IND CO LTD:THE | 1999-04-13 | — | — | JP | disclosed |
| JP-H10110008-A | PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM RESIST USING THE SAME | NIPPON SYNTHETIC CHEM IND CO LTD:THE | 1998-04-28 | — | — | JP | disclosed |
| JP-H06177510-A | MANUFACTURE OF PRINTED WIRING BOARD | NIPPON SYNTHETIC CHEM IND CO LTD:THE | 1994-06-24 | — | — | JP | disclosed |
| JP-H0669631-A | MANUFACTURE OF PRINTED WIRING BOARD | NIPPON SYNTHETIC CHEM IND CO LTD:THE | 1994-03-11 | — | — | JP | disclosed |