⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9441451 | 0.76 | — | — | |
| SCHEMBL3244004 | 0.76 | — | — | |
| SCHEMBL9367428 | 0.74 | RAB9A (0.46) | — | |
| SCHEMBL22245499 | 0.74 | — | — | |
| SCHEMBL9547360 | 0.74 | — | — | |
| SCHEMBL1223690 | 0.74 | — | — | |
| SCHEMBL1325460 | 0.72 | RAB9A (0.45) | — | |
| SCHEMBL16199152 | 0.72 | RAB9A (0.41) | — | |
| SCHEMBL10475166 | 0.71 | LMNA (0.48) | — | |
| SCHEMBL9367407 | 0.71 | RAB9A (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102585704-B | Chemical mechanical polishing slurry composition and use it to manufacture the method for semiconducter device | SOULBRAIN CO. (KR) | 2016-02-24 | — | — | CN | claimed |
| US-8840798-B2 | Chemical mechanical polishing slurry composition and method for producing semiconductor device using the same | SOULBRAIN CO., LTD. (KR) | 2014-09-23 | — | — | US | claimed |
| CN-102585704-A | Chemical mechanical polishing slurry composition and method for producing semiconductor device using the same | SOULBRAIN CO LTD | 2012-07-18 | — | — | CN | claimed |
| US-20120156874-A1 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME | SOULBRAIN CO., LTD (KR) | 2012-06-21 | — | — | US | claimed |
| US-20100176335-A1 | CMP Slurry Composition for Copper Damascene Process | TECHNO SEMICHEM CO., LTD. (KR) | 2010-07-15 | — | — | US | claimed |
| US-20100015807-A1 | Chemical Mechanical Polishing Composition for Copper Comprising Zeolite | TECHNO SEMICHEM CO., LTD. (KR) | 2010-01-21 | — | — | US | claimed |
| US-20090298289-A1 | Chemical Mechanical Polishing Composition for Copper Comprising Zeolite | TECHNO SEMICHEM CO., LTD. (KR) | 2009-12-03 | — | — | US | claimed |
| CN-101541913-A | Zeolite-containing chemical mechanical polishing composition for copper | TECHNO SEMICHEM CO LTD (KR) | 2009-09-23 | — | — | CN | claimed |
| WO-2008150038-A1 | CMP SLURRY COMPOSITION FOR COPPER DAMASCENE PROCESS | TECHNO SEMICHEM CO., LTD. (KR) | 2008-12-11 | — | — | WO | claimed |
| WO-2008078909-A1 | CHEMICAL MECHANICAL POLISHING COMPOSITION FOR COPPER COMPRISING ZEOLITE | TECHNO SEMICHEM CO., LTD. (KR) | 2008-07-03 | — | — | WO | claimed |
| WO-2007114583-A1 | CHEMICAL MECHANICAL POLISHING COMPOSITION FOR COPPER COMPRISING ZEOLITE | TECHNO SEMICHEM CO., LTD. (KR) | 2007-10-11 | — | — | WO | claimed |
| CN-102585704-B | Chemical mechanical polishing slurry composition and use it to manufacture the method for semiconducter device | SOULBRAIN CO. (KR) | 2016-02-24 | — | — | CN | disclosed |
| US-8840798-B2 | Chemical mechanical polishing slurry composition and method for producing semiconductor device using the same | SOULBRAIN CO., LTD. (KR) | 2014-09-23 | — | — | US | disclosed |
| CN-102585704-A | Chemical mechanical polishing slurry composition and method for producing semiconductor device using the same | SOULBRAIN CO LTD | 2012-07-18 | — | — | CN | disclosed |
| US-20120156874-A1 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME | SOULBRAIN CO., LTD (KR) | 2012-06-21 | — | — | US | disclosed |
| US-20090298289-A1 | Chemical Mechanical Polishing Composition for Copper Comprising Zeolite | TECHNO SEMICHEM CO., LTD. (KR) | 2009-12-03 | — | — | US | disclosed |
| CN-101541913-A | Zeolite-containing chemical mechanical polishing composition for copper | TECHNO SEMICHEM CO LTD (KR) | 2009-09-23 | — | — | CN | disclosed |
| WO-2008150038-A1 | CMP SLURRY COMPOSITION FOR COPPER DAMASCENE PROCESS | TECHNO SEMICHEM CO., LTD. (KR) | 2008-12-11 | — | — | WO | disclosed |
| WO-2008078909-A1 | CHEMICAL MECHANICAL POLISHING COMPOSITION FOR COPPER COMPRISING ZEOLITE | TECHNO SEMICHEM CO., LTD. (KR) | 2008-07-03 | — | — | WO | disclosed |
| WO-2007114583-A1 | CHEMICAL MECHANICAL POLISHING COMPOSITION FOR COPPER COMPRISING ZEOLITE | TECHNO SEMICHEM CO., LTD. (KR) | 2007-10-11 | — | — | WO | disclosed |